Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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774
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Obsolete - - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 8 (2 x 4) Beryllium Copper - Brass
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849
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) 8 (2 x 4) Beryllium Copper 47.2µin (1.20µm) Copper Alloy
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1,577
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) 6 (2 x 3) Beryllium Copper 47.2µin (1.20µm) Copper Alloy