Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,031
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS TIN 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin - - 14 (2 x 7) Beryllium Copper - Copper
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3,779
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN-LEAD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - Tin-Lead 8 (2 x 4) Copper Alloy - Copper Alloy
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2,307
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS 500 Active - - Through Hole - Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 28 (2 x 14) - - -
522-AG10D
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1,227
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 22 (2 x 11) Copper Alloy - Copper Alloy
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3,204
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 16 (2 x 8) Beryllium Copper - Brass
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1,471
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 500 Active Bulk - Through Hole Solder Closed Frame SIP - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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868
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS 500 Active - - Through Hole - Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 32 (2 x 16) - - -
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737
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 22 (2 x 11) Beryllium Copper 25.0µin (0.63µm) Nickel
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3,199
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Gold 28 (2 x 14) Copper Alloy - Copper Alloy
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760
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 20 (2 x 10) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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1,451
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 22 (2 x 11) Beryllium Copper - Beryllium Copper
6-1437536-3
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1,462
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 32 (2 x 16) Beryllium Copper - Brass
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1,673
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Beryllium Copper - Nickel
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3,135
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper - Nickel
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3,638
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 24 (2 x 12) Beryllium Copper - Brass
2-1571550-8
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2,783
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 24 (2 x 12) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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2,337
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - - 20 (2 x 10) Beryllium Copper - Brass
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1,520
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TE Connectivity AMP Connectors CONN SOCKET SIP 12POS GOLD 500 Active Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 12 (1 x 12) Beryllium Copper - Beryllium Copper
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1,404
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper - Nickel
5-1571551-0
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RFQ
3,681
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 32 (2 x 16) Beryllium Copper 25.0µin (0.63µm) Nickel
9-1437535-1
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946
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper 25.0µin (0.63µm) Copper Alloy
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3,718
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 14 (2 x 7) Copper Alloy - Copper Alloy
2-1571550-3
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RFQ
2,428
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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3,399
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Gold 28 (2 x 14) Copper Alloy - Copper Alloy
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866
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 40 (2 x 20) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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634
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 40 (2 x 20) Beryllium Copper - Beryllium Copper
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3,271
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 40 (2 x 20) Beryllium Copper - Beryllium Copper
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1,212
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TINLEAD 500 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 16 (2 x 8) Beryllium Copper - Beryllium Copper
5-1437536-2
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RFQ
2,024
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 28 (2 x 14) Beryllium Copper - Brass
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3,477
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 24 (2 x 12) Beryllium Copper - Beryllium Copper