Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
2,031
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS TIN 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) Tin - 14 (2 x 7) Beryllium Copper Copper
Default Photo
RFQ
VIEW
RFQ
1,471
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 500 Active Bulk - Through Hole Solder Closed Frame SIP 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper Beryllium Copper
6-1437536-3
RFQ
VIEW
RFQ
1,462
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
2,337
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) Tin-Lead - 20 (2 x 10) Beryllium Copper Brass
9-1437535-1
RFQ
VIEW
RFQ
946
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) Gold 25.0µin (0.63µm) 14 (2 x 7) Beryllium Copper Copper Alloy
5-1437536-2
RFQ
VIEW
RFQ
2,024
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) Gold - 28 (2 x 14) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
2,151
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) Gold 25.0µin (0.63µm) 6 (2 x 3) Beryllium Copper Brass
540-AG10D-ES
RFQ
VIEW
RFQ
3,417
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) Gold - 40 (2 x 20) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
2,695
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) Gold 5.00µin (0.127µm) 24 (2 x 12) Beryllium Copper Brass
516-AG10D-ES
RFQ
VIEW
RFQ
3,855
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) Gold - 16 (2 x 8) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
3,483
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 500 Active Bulk - Through Hole Solder Closed Frame SIP 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper Beryllium Copper
532-AG11D-ES
RFQ
VIEW
RFQ
876
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
2,260
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing 0.100" (2.54mm) Gold 25.0µin (0.63µm) 24 (2 x 12) Beryllium Copper Brass
3-1437536-8
RFQ
VIEW
RFQ
2,327
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) Gold - 24 (2 x 12) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
796
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) Tin-Lead - 32 (2 x 16) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
3,962
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) Gold - 20 (2 x 10) Beryllium Copper Brass
508-AG10D-ESL
RFQ
VIEW
RFQ
2,219
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) Gold 5.00µin (0.127µm) 8 (2 x 4) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
666
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) Gold - 28 (2 x 14) Beryllium Copper Brass
516-AG10D
RFQ
VIEW
RFQ
3,052
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) Gold - 16 (2 x 8) Beryllium Copper Brass