Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
9-1437535-1
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946
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper Copper Alloy
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RFQ
2,151
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 6 (2 x 3) Beryllium Copper Brass
508-AG10D
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RFQ
2,740
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Copper Alloy Copper Alloy
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RFQ
2,260
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 24 (2 x 12) Beryllium Copper Brass