Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,828
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 3POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 3 (1 x 3) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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3,465
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TE Connectivity AMP Connectors CONN SOCKET PGA 321POS GOLD - Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 321 (19 x 19) Copper Alloy - Copper Alloy
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2,368
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3M CONN SOCKET PLCC 84POS GOLD OEM Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame PLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold Flash Gold 84 (4 x 21) Beryllium Copper Flash Beryllium Copper
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1,308
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TE Connectivity AMP Connectors CONN SOCKET PGA 321POS GOLD - Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 321 (19 x 19) Copper Alloy - Copper Alloy
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2,571
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Samtec Inc. CONN IC DIP SOCKET 16POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 16 (2 x 8) Beryllium Copper - Brass
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1,514
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Samtec Inc. CONN IC DIP SOCKET 14POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 14 (2 x 7) Beryllium Copper - Brass
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948
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 20 (2 x 10) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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2,117
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 7POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.75" (19.05mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 7 (1 x 7) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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2,340
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Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICA Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper - Brass
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3,801
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Samtec Inc. CONN IC DIP SOCKET 16POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 16 (2 x 8) Beryllium Copper - Brass
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1,558
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Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICA Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 8 (2 x 4) Beryllium Copper - Brass
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2,782
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Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 8 (2 x 4) Beryllium Copper - Brass
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2,296
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Samtec Inc. CONN IC DIP SOCKET 14POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 14 (2 x 7) Beryllium Copper - Brass
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1,049
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Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 8 (2 x 4) Beryllium Copper - Brass
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3,460
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 6 (2 x 3) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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1,304
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 24 (2 x 12) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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3,114
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 22 (2 x 11) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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2,409
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Samtec Inc. CONN IC DIP SOCKET 32POS TIN ICA Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper - Brass
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882
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Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICA Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper - Brass
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1,198
In-stock
Samtec Inc. CONN IC DIP SOCKET 14POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 14 (2 x 7) Beryllium Copper - Brass