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7 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW |
3,835
In-stock
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Aries Electronics | CONN SOCKET PGA GOLD | PGM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,452
In-stock
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Aries Electronics | CONN SOCKET PGA GOLD | PGM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,161
In-stock
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3M | CONN IC DIP SOCKET ZIF 40POS GLD | OEM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Gold | 40 (2 x 20) | Beryllium Copper | 250.0µin (6.35µm) | Beryllium Copper | |||
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VIEW |
806
In-stock
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3M | CONN IC DIP SOCKET ZIF 20POS GLD | OEM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Gold | 20 (2 x 10) | Beryllium Copper | 250.0µin (6.35µm) | Beryllium Copper | |||
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VIEW |
1,816
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TINLEAD | 500 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | - | 40 (2 x 20) | Beryllium Copper | - | Brass | |||
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VIEW |
986
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | Vertisockets™ 800 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,829
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 8POS TIN-LEAD | - | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Fluoropolymer (FP) | 0.100" (2.54mm) | Tin-Lead | 150.0µin (3.81µm) | Tin-Lead | 8 (1 x 8) | Beryllium Copper | 150.0µin (3.81µm) | Beryllium Copper | |||
