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4 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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VIEW |
2,964
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | 28 (2 x 14) | - | - | - | ||||
VIEW |
1,632
In-stock
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CNC Tech | CONN IC DIP SOCKET 28POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | - | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,521
In-stock
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CNC Tech | CONN IC DIP SOCKET 28POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,490
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 28POS TIN | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 28 (2 x 14) | Copper Alloy | 100.0µin (2.54µm) | Copper Alloy |