Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,256
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 64POS TIN 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyester 0.100" (2.54mm) Tin - - 64 (2 x 32) Copper Alloy - -
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1,127
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 64POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 64 (2 x 32) Beryllium Copper 25.0µin (0.63µm) Copper
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2,111
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 64POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 64 (2 x 32) Beryllium Copper Flash Copper
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641
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 64POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 64 (2 x 32) Copper Alloy - -
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2,514
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Aries Electronics CONN IC DIP SOCKET 64POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,776
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Aries Electronics CONN IC DIP SOCKET 64POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
864-AG11D-ESL
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1,627
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 64POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyester 0.100" (2.54mm) Gold Flash - 64 (2 x 32) Copper Alloy - -
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3,085
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 64POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 64 (2 x 32) Copper Alloy - -
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1,894
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 64POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 64 (2 x 32) Beryllium Copper 20.0µin (0.51µm) Copper