Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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A06-LCG-T
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1,324
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Assmann WSW Components CONN IC DIP SOCKET 6POS GOLD - Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold - Gold 6 (2 x 3) - - -
A06-LCG-T-R
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794
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Assmann WSW Components CONN IC DIP SOCKET 6POS GOLD - Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold - Gold 6 (2 x 3) - - -
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2,600
In-stock
CNC Tech CONN IC DIP SOCKET 6POS GOLD - Active Tube -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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2,111
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Aries Electronics CONN IC DIP SOCKET 6POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,488
In-stock
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,294
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 6 (2 x 3) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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3,460
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 6 (2 x 3) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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2,938
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CNC Tech CONN IC DIP SOCKET 6POS GOLD - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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1,034
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 6 (2 x 3) Beryllium Copper - Beryllium Copper