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- Contact Finish Thickness - Mating :
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23 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
2,912
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN-LEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 8 (2 x 4) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
3,956
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN-LEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 8 (2 x 4) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
2,618
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 8 (2 x 4) | - | - | - | |||
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VIEW |
1,119
In-stock
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CNC Tech | CONN IC DIP SOCKET 8POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,340
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 8POS GOLD | ICA | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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|
VIEW |
3,999
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 8 (2 x 4) | Beryllium Copper | - | Copper | |||
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|
VIEW |
1,558
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | ICA | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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|
VIEW |
2,782
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | ICO | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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|
VIEW |
3,146
In-stock
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CNC Tech | CONN IC DIP SOCKET 8POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | - | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,434
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 8 (2 x 4) | Beryllium Copper | 25.0µin (0.63µm) | Copper | |||
|
VIEW |
3,058
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 8 (2 x 4) | Copper Alloy | - | - | |||
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|
VIEW |
1,049
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | ICO | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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|
VIEW |
3,264
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 8 (2 x 4) | Copper Alloy | - | - | |||
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|
VIEW |
2,319
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 8 (2 x 4) | Beryllium Copper | - | Copper | |||
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|
VIEW |
1,804
In-stock
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,790
In-stock
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,677
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 8 (2 x 4) | Copper Alloy | 5.00µin (0.127µm) | Copper Alloy | |||
|
VIEW |
903
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN-LEAD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | - | 8 (2 x 4) | Copper Alloy | - | - | |||
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|
VIEW |
882
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 8POS GOLD | ICA | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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|
VIEW |
1,637
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 8 (2 x 4) | Copper Alloy | 80.0µin (2.03µm) | Copper Alloy | |||
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|
VIEW |
773
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Gold | 8 (2 x 4) | Beryllium Copper | Flash | Copper | |||
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|
VIEW |
2,772
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 8 (2 x 4) | Beryllium Copper | 20.0µin (0.51µm) | Copper | |||
|
VIEW |
3,362
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 8POS TIN | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 8 (2 x 4) | Copper Alloy | 100.0µin (2.54µm) | Copper Alloy | |||
