Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
ASU02DXTB
RFQ
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RFQ
1,081
In-stock
Sullins Connector Solutions CONN SOCKET AXIAL 2POS GOLD - Obsolete Bulk Through Hole Solder Board Guide Axial - - Gold 10.0µin (0.25µm) 2 (Rectangular) - 10.0µin (0.25µm) -
28-516-10
RFQ
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RFQ
2,644
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 516 Obsolete Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
24-516-10
RFQ
VIEW
RFQ
1,927
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
40-516-10
RFQ
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RFQ
3,434
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
6-1437535-3
RFQ
VIEW
RFQ
1,771
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 8POS GOLD 500 Obsolete Bulk Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (1 x 8) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
RFQ
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RFQ
1,250
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 68POS GOLD - Obsolete Bulk Through Hole Press-Fit Open Frame PGA Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 68 (11 x 11) Beryllium Copper 10.0µin (0.25µm) Brass