- Series :
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- 101 (7)
- 110 (287)
- 111 (22)
- 114 (82)
- 115 (91)
- 116 (345)
- 117 (6)
- 121 (23)
- 122 (41)
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- 124 (23)
- 126 (33)
- 127 (2)
- 146 (63)
- 210 (24)
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- 299 (72)
- 500 (50)
- 501 (18)
- 503 (36)
- 508 (40)
- 511 (6)
- 612 (30)
- 614 (73)
- 700 (7)
- 800 (1)
- BU-178HT (6)
- D0 (14)
- D2 (8)
- D26 (4)
- D39 (7)
- D95 (7)
- DILB (2)
- Diplomate DL (40)
- Edge-Grip™, C91 (5)
- EJECT-A-DIP™ (13)
- IC (2)
- ICA (13)
- iCF (7)
- ICO (8)
- Lo-PRO®file, C93 (1)
- XR2 (14)
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- Termination :
- Housing Material :
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- Aluminum Alloy (7)
- Liquid Crystal Polymer (LCP) (8)
- Plastic (7)
- Polyamide (PA), Nylon (2)
- Polyamide (PA), Nylon, Glass Filled (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (119)
- Polybutylene Terephthalate (PBT), Glass Filled (20)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (32)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (535)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (791)
- Polyester (9)
- Polyester, Glass Filled (22)
- Thermoplastic (9)
- Thermoplastic, Glass Filled (35)
- Thermoplastic, Polyester (25)
- Pitch - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 10 (2 x 5) (97)
- 12 (2 x 6) (67)
- 12 (2 x 6), 6 Loaded (2)
- 14 (2 x 7) (189)
- 14 (2 x 7), 4 Loaded (3)
- 14 (2 x 7), 8 Loaded (5)
- 16 (2 x 8) (198)
- 16 (2 x 8), 4 Loaded (3)
- 16 (2 x 8), 8 Loaded (8)
- 18 (2 x 9) (154)
- 20 (2 x 10) (178)
- 22 (2 x 11) (88)
- 24 (2 x 12) (139)
- 26 (2 x 13) (2)
- 28 (2 x 14) (109)
- 28 (2 x 14), 14 Loaded (3)
- 28 (2 x 14), 16 Loaded (3)
- 30 (2 x 15) (2)
- 32 (2 x 16) (2)
- 320 (19 x 19) (1)
- 321 (21 x 21) (1)
- 325 (18 x 18) (1)
- 34 (2 x 17) (2)
- 36 (2 x 18) (2)
- 38 (2 x 19) (2)
- 4 (2 x 2) (73)
- 40 (2 x 20) (2)
- 6 (2 x 3) (127)
- 8 (2 x 4) (178)
- 8 (2 x 4), 4 Loaded (1)
- 99 (1 x 99) (1)
- Contact Material - Mating :
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- Applied Filters :
1643 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,184
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 14 (2 x 7) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,773
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | - | Gold | 16 (2 x 8) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
1,547
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,573
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
728
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,185
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
1,890
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
1,060
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,934
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 6POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
876
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
2,860
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
1,176
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
2,187
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,435
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,550
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 6POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,837
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 16POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
3,605
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 16POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 16 (2 x 8) | Beryllium Copper | 30.0µin (0.76µm) | Phosphor Bronze | |||
|
VIEW |
2,641
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | Lo-PRO®file, C93 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
3,122
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
3,360
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 18 (2 x 9) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
3,557
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 8 (2 x 4) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
3,710
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 6 (2 x 3) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
3,167
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
2,246
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
1,145
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
1,946
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
938
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 8 (2 x 4) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
1,367
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 16 (2 x 8) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
856
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole, Right Angle, Vertical | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 18 (2 x 9) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
3,705
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 20 (2 x 10) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper |