- Part Status :
- Housing Material :
-
- Aluminum Alloy (2)
- Liquid Crystal Polymer (LCP) (4)
- Plastic (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (3)
- Polybutylene Terephthalate (PBT), Glass Filled (4)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (2)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (51)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (62)
- Polyester (2)
- Polyester, Glass Filled (4)
- Thermoplastic (1)
- Thermoplastic, Glass Filled (6)
- Thermoplastic, Polyester (5)
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
151 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,060
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,557
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 8 (2 x 4) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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|
VIEW |
802
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 8 (2 x 4) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
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|
VIEW |
3,394
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 8 (2 x 4) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
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|
VIEW |
2,676
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 800 | Obsolete | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 8 (2 x 4) | Copper Alloy | - | Brass | |||
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|
VIEW |
1,519
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 8 (2 x 4) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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|
VIEW |
1,287
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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|
VIEW |
1,155
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 8 (2 x 4) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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|
VIEW |
1,539
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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|
VIEW |
2,560
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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|
VIEW |
1,157
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 8 (2 x 4) | Beryllium Copper | 25.0µin (0.63µm) | Nickel | |||
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|
VIEW |
1,114
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Gold | 8 (2 x 4) | Beryllium Copper | 5.00µin (0.127µm) | Brass | |||
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|
VIEW |
874
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | Gold | 8 (2 x 4) | Beryllium Copper | Flash | Brass | |||
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|
VIEW |
1,877
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 30.0µin (0.76µm) | Brass | |||
|
VIEW |
1,300
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
3,779
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN-LEAD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 8 (2 x 4) | Copper Alloy | - | Copper Alloy | |||
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|
VIEW |
3,623
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
1,309
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,414
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
3,952
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
2,839
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS TIN-LEAD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Tin-Lead | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,810
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 8 (2 x 4) | Copper Alloy | - | Copper Alloy | |||
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|
VIEW |
633
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 614 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
2,302
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 8 (2 x 4) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
1,448
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 8 (2 x 4) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
3,027
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,253
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 101 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,138
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,949
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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|
VIEW |
1,489
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | - | Active | - | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
