Contact Finish - Post :
Number of Positions or Pins (Grid) :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,773
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Preci-Dip CONN SOCKET PGA 281POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 281 (19 x 19) Beryllium Copper - Brass
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3,631
In-stock
Preci-Dip CONN SOCKET PGA 281POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 281 (19 x 19) Beryllium Copper - Brass
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RFQ
3,782
In-stock
Preci-Dip CONN SOCKET PGA 279POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 279 (19 x 19) Beryllium Copper - Brass
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RFQ
3,999
In-stock
Preci-Dip CONN SOCKET PGA 279POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 279 (19 x 19) Beryllium Copper - Brass
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RFQ
2,017
In-stock
Preci-Dip CONN SOCKET PGA 296POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 296 (19 x 19) Beryllium Copper - Brass
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RFQ
902
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PGA 261POS GOLD 510 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 261 (19 x 19) Beryllium Copper - Brass Alloy
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RFQ
2,331
In-stock
Preci-Dip CONN SOCKET PGA 321POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 321 (19 x 19) Beryllium Copper - Brass
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RFQ
2,137
In-stock
Preci-Dip CONN SOCKET PGA 299POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 299 (20 x 20) Beryllium Copper - Brass
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RFQ
1,587
In-stock
Preci-Dip CONN SOCKET PGA 299POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 299 (20 x 20) Beryllium Copper - Brass
Default Photo
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RFQ
2,104
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
3,190
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 225 (18 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
2,357
In-stock
Preci-Dip CONN SOCKET PGA 296POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 296 (19 x 19) Beryllium Copper - Brass
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RFQ
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RFQ
2,985
In-stock
Preci-Dip CONN SOCKET PGA 325POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 325 (18 x 18) Beryllium Copper - Brass
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RFQ
VIEW
RFQ
1,755
In-stock
Preci-Dip CONN SOCKET PGA 321POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 321 (21 x 21) Beryllium Copper - Brass
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VIEW
RFQ
3,544
In-stock
Preci-Dip CONN SOCKET PGA 320POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 320 (19 x 19) Beryllium Copper - Brass
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RFQ
1,321
In-stock
Preci-Dip CONN SOCKET PGA 257POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 257 (20 x 20) Beryllium Copper - Brass
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RFQ
1,443
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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VIEW
RFQ
3,082
In-stock
Preci-Dip CONN SOCKET PGA 281POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 281 (19 x 19) Beryllium Copper - Brass
Default Photo
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VIEW
RFQ
2,533
In-stock
Preci-Dip CONN SOCKET PGA 225POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 225 (17 x 17) Beryllium Copper - Brass
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VIEW
RFQ
635
In-stock
Preci-Dip CONN SOCKET PGA 279POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 279 (19 x 19) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
2,937
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
1,831
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
1,612
In-stock
Preci-Dip CONN SOCKET PGA 179POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 179 (15 x 15) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
3,335
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
875
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PGA 145POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 145 (15 x 15) Beryllium Copper - Brass Alloy
510-93-145-15-081001
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VIEW
RFQ
651
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PGA 145POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 145 (15 x 15) Beryllium Copper - Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,991
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
713
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PGA 175POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 175 (16 x 16) Beryllium Copper - Brass Alloy
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RFQ
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RFQ
1,124
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
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VIEW
RFQ
2,904
In-stock
Preci-Dip CONN SOCKET PGA 361POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 361 (19 x 19) Beryllium Copper - Brass