Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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110-93-632-41-105000
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3,075
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-432-41-105000
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RFQ
2,112
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,684
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 101 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-632-41-605000
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RFQ
2,809
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
3,779
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-432-41-001000
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VIEW
RFQ
1,477
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,943
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,556
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-632-41-001000
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VIEW
RFQ
1,962
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,127
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-99-432-41-001000
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RFQ
3,148
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
111-43-632-41-001000
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RFQ
2,746
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
111-93-632-41-001000
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VIEW
RFQ
1,402
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-632-41-001000
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VIEW
RFQ
1,091
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-632-41-001000
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VIEW
RFQ
2,999
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-99-632-41-001000
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VIEW
RFQ
3,421
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-632-41-003000
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RFQ
1,661
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-93-632-41-001000
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VIEW
RFQ
3,068
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-93-632-41-003000
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VIEW
RFQ
907
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-47-632-41-003000
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VIEW
RFQ
3,561
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
111-47-632-41-001000
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VIEW
RFQ
2,572
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-47-632-41-001000
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VIEW
RFQ
1,213
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-47-632-41-001000
RFQ
VIEW
RFQ
1,721
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-41-632-41-001000
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VIEW
RFQ
2,546
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-432-41-001000
RFQ
VIEW
RFQ
1,835
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-43-632-41-001000
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VIEW
RFQ
2,563
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-44-632-41-001000
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RFQ
2,652
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TIN 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy