Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,327
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 10POS GOLD - Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Gold 10 (2 x 5) Beryllium Copper Flash Brass
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2,989
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 10POS TIN - Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 10 (2 x 5) Beryllium Copper 196.9µin (5.00µm) Brass
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2,072
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,655
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-99-310-41-001000
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2,760
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-310-41-001000
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1,171
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-91-210-41-001000
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2,944
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-99-210-41-001000
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RFQ
1,351
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-310-41-001000
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1,719
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-310-41-105000
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RFQ
1,747
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-210-41-105000
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RFQ
770
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-210-41-001000
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RFQ
3,638
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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1,883
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-310-41-001000
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RFQ
3,792
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-83-610-41-001101
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RFQ
761
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
110-83-310-41-001101
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RFQ
3,468
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
110-83-210-41-001101
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2,858
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
110-87-310-41-105101
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1,847
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass
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1,294
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass
115-83-310-41-003101
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RFQ
2,934
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
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2,114
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Preci-Dip CONN IC DIP SOCKET 10POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
114-83-310-41-117101
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RFQ
911
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
114-83-210-41-117101
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RFQ
2,978
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
115-83-610-41-001101
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RFQ
3,554
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
115-83-310-41-001101
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VIEW
RFQ
794
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
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3,339
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
115-87-310-41-003101
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RFQ
3,578
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass
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3,916
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass
114-87-310-41-117101
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RFQ
1,843
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass
114-87-210-41-117101
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RFQ
3,234
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass