- Operating Temperature :
- Number of Positions or Pins (Grid) :
- Contact Material - Mating :
- Applied Filters :
7 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
1,188
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 10POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | 10 (2 x 5) | Beryllium Copper | Flash | Brass | |||
|
VIEW |
656
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 10POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
671
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 28POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,020
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 22POS TIN | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | 22 (2 x 11) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
3,355
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 32POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,345
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 4POS TIN | - | Active | Bulk | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,589
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper |