Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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2,372
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Aries Electronics CONN SOCKET SIP 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,986
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Aries Electronics CONN SOCKET SIP 32POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (1 x 32) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,729
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Aries Electronics CONN SOCKET SIP 32POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (1 x 32) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,508
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Aries Electronics CONN SOCKET SIP 32POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (1 x 32) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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Aries Electronics CONN SOCKET SIP 32POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (1 x 32) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,801
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Aries Electronics CONN SOCKET SIP 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,537
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Aries Electronics CONN SOCKET SIP 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,035
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Aries Electronics CONN SOCKET SIP 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,578
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Aries Electronics CONN SOCKET SIP 32POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass