- Part Status :
- Packaging :
- Operating Temperature :
- Mounting Type :
- Termination :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
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- Applied Filters :
787 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,094
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
907
In-stock
|
Aries Electronics | CONN SOCKET PLCC ZIF 32POS GOLD | 536 | Obsolete | - | - | Through Hole | - | Open Frame | PLCC, ZIF (ZIP) | - | 0.050" (1.27mm) | Gold | 12.0µin (0.30µm) | - | 32 (2 x 7, 2 x 9) | - | - | - | |||
|
VIEW |
3,162
In-stock
|
Aries Electronics | CONN SOCKET PLCC ZIF 52POS GOLD | 536 | Obsolete | - | - | Through Hole | - | Open Frame | PLCC, ZIF (ZIP) | - | 0.050" (1.27mm) | Gold | 12.0µin (0.30µm) | - | 52 (4 x 13) | - | - | - | |||
|
VIEW |
2,256
In-stock
|
Aries Electronics | CONN SOCKET PLCC ZIF 84POS GOLD | 536 | Obsolete | - | - | Through Hole | - | Open Frame | PLCC, ZIF (ZIP) | - | 0.050" (1.27mm) | Gold | 12.0µin (0.30µm) | - | 84 (4 x 21) | - | - | - | |||
|
VIEW |
2,679
In-stock
|
Aries Electronics | CONN SOCKET PLCC ZIF 68POS GOLD | 536 | Obsolete | - | - | Through Hole | - | Open Frame | PLCC, ZIF (ZIP) | - | 0.050" (1.27mm) | Gold | 12.0µin (0.30µm) | - | 68 (4 x 17) | - | - | - | |||
|
VIEW |
1,247
In-stock
|
Aries Electronics | CONN SOCKET PLCC ZIF 44POS GOLD | 536 | Obsolete | - | - | Through Hole | - | Open Frame | PLCC, ZIF (ZIP) | - | 0.050" (1.27mm) | Gold | 12.0µin (0.30µm) | - | 44 (4 x 11) | - | - | - | |||
|
VIEW |
986
In-stock
|
Aries Electronics | CONN SOCKET PLCC ZIF 28POS GOLD | 536 | Obsolete | - | - | Through Hole | - | Open Frame | PLCC, ZIF (ZIP) | - | 0.050" (1.27mm) | Gold | 12.0µin (0.30µm) | - | 28 (4 x 7) | - | - | - | |||
|
|
VIEW |
1,964
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,057
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,947
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,189
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
741
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,308
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,818
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | 518 | Obsolete | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 60 (2 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,937
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
721
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,531
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,117
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,516
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,319
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,755
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,211
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
632
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,239
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 42 (2 x 21) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,826
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,200
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,518
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,946
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,784
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,111
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
