Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,816
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TINLEAD 500 Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - - 40 (2 x 20) Beryllium Copper - Brass
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3,111
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD - Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 8 (2 x 4) Beryllium Copper - Brass
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1,228
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS - Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) - - - 28 (2 x 14) Beryllium Copper - Copper
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3,199
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Gold 28 (2 x 14) Copper Alloy - Copper Alloy
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3,399
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Gold 28 (2 x 14) Copper Alloy - Copper Alloy
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2,143
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS TINLEAD 500 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 24 (2 x 12) Beryllium Copper - Brass, Copper
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1,881
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD - Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - Tin 24 (2 x 12) Beryllium Copper - Brass
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2,717
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) Tin-Lead 28 (2 x 14) Beryllium Copper 5.00µin (0.127µm) Brass, Copper
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3,460
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 6 (2 x 3) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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2,708
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN 500 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Beryllium Copper - Beryllium Copper
1-2199299-5
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3,663
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TE Connectivity AMP Connectors 40P,DIP SKT,600 CL,LDR,PB FREE Diplomate DL Active Bulk -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 40 (2 x 20) Phosphor Bronze 60.0µin (1.52µm) Nickel
1-2199299-2
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3,240
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TE Connectivity AMP Connectors 28P,DIP SKT,600 CL,LDR,PB FREE Diplomate DL Active Bulk -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 28 (2 x 14) Phosphor Bronze 60.0µin (1.52µm) Nickel