Contact Finish - Mating :
Contact Finish Thickness - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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3,078
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - 32 (2 x 16) Beryllium Copper Copper
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2,447
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 32 (2 x 16) Beryllium Copper Copper
5-1571552-0
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828
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) 32 (2 x 16) Beryllium Copper Copper
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1,492
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - 32 (2 x 16) Beryllium Copper Copper