Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
2-382189-2
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RFQ
2,539
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper
1-390262-3
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RFQ
1,026
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN - Obsolete Cut Tape (CT) -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Phosphor Bronze
1-390262-3
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RFQ
2,320
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN - Obsolete Tape & Reel (TR) -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Phosphor Bronze
1825276-2
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RFQ
1,262
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 32 (2 x 16) Phosphor Bronze
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RFQ
3,201
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.6" (15.24mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 32 (2 x 16) Beryllium Copper
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RFQ
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RFQ
1,224
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) - 32 (2 x 16) Copper Alloy
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RFQ
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RFQ
1,373
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Tin-Lead 32 (2 x 16) Phosphor Bronze
2-644018-4
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RFQ
2,592
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 32 (2 x 16) Phosphor Bronze
2-644018-2
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RFQ
966
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper
2-382189-1
RFQ
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RFQ
3,389
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN Diplomate DL Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper
3-382568-2
RFQ
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RFQ
1,350
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Phosphor Bronze
2-382470-3
RFQ
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RFQ
849
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - Tin-Lead 32 (2 x 16) Phosphor Bronze
Default Photo
RFQ
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RFQ
1,025
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 32 (2 x 16) Phosphor Bronze