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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post
GLOBAL STOCKS
	2-382189-2	RFQ VIEW	PDF RFQ	2,539 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 32POS GOLD		Diplomate DL	Obsolete	Tube	-	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin-Lead	32 (2 x 16)	Beryllium Copper	-
	1-1825109-1	RFQ VIEW	PDF RFQ	2,375 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD		Diplomate DL	Obsolete	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	24 (2 x 12)	Beryllium Copper	30.0µin (0.76µm)
	2-641605-2	RFQ VIEW	PDF RFQ	1,977 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD		Diplomate DL	Obsolete	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	28 (2 x 14)	Beryllium Copper	30.0µin (0.76µm)
	2-641606-2	RFQ VIEW	PDF RFQ	2,902 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD		Diplomate DL	Obsolete	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	40 (2 x 20)	Beryllium Copper	30.0µin (0.76µm)
	2-640361-2	RFQ VIEW	PDF RFQ	1,361 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD		Diplomate DL	Obsolete	Tube	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	24 (2 x 12)	Beryllium Copper	30.0µin (0.76µm)
	2-640362-2	RFQ VIEW	PDF RFQ	2,853 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD		Diplomate DL	Obsolete	Tube	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	28 (2 x 14)	Beryllium Copper	30.0µin (0.76µm)
	2-644018-2	RFQ VIEW	PDF RFQ	966 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 32POS GOLD		Diplomate DL	Obsolete	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	32 (2 x 16)	Beryllium Copper	30.0µin (0.76µm)
	2-641616-2	RFQ VIEW	PDF RFQ	3,397 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD		Diplomate DL	Obsolete	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	40 (2 x 20)	Beryllium Copper	30.0µin (0.76µm)
	2-641604-2	RFQ VIEW	PDF RFQ	1,734 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD		Diplomate DL	Obsolete	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	24 (2 x 12)	Beryllium Copper	30.0µin (0.76µm)
	1-1825108-3	RFQ VIEW	PDF RFQ	3,445 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD		Diplomate DL	Obsolete	Tube	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	40 (2 x 20)	Beryllium Copper	30.0µin (0.76µm)
	1-1825108-1	RFQ VIEW	PDF RFQ	614 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD		Diplomate DL	Obsolete	Tube	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	24 (2 x 12)	Beryllium Copper	30.0µin (0.76µm)

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