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21 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | |
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GLOBAL STOCKS | |||||||||||||||||||||||
VIEW |
1,020
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 3 (Oval) | Beryllium Copper | Beryllium Copper | ||||
VIEW |
3,037
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 3 (Oval) | Beryllium Copper | Beryllium Copper | ||||
VIEW |
2,750
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 10POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon | - | Gold | - | Tin-Lead | 10 (Round) | Beryllium Copper | Brass | ||||
VIEW |
2,801
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Tin-Lead | 40 (2 x 20) | Phosphor Bronze | Phosphor Bronze | ||||
VIEW |
1,933
In-stock
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TE Connectivity AMP Connectors | CONN IC SIP SOCKET 8POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyester | 0.100" (2.54mm) | Gold | - | Tin-Lead | 8 (1 x 8) | Beryllium Copper | Brass | ||||
VIEW |
3,683
In-stock
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TE Connectivity AMP Connectors | CONN TRANSIST TO-3 3POS TIN-LEAD | 8060 | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Polytetrafluoroethylene (PTFE) | - | Tin-Lead | - | Tin-Lead | 3 (Oval) | Beryllium Copper | Beryllium Copper | ||||
VIEW |
1,373
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Tin-Lead | 32 (2 x 16) | Phosphor Bronze | Phosphor Bronze | ||||
VIEW |
3,779
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN-LEAD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 8 (2 x 4) | Copper Alloy | Copper Alloy | ||||
VIEW |
3,659
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Active | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Tin-Lead | 20.0µin (0.51µm) | Tin-Lead | 3 (Round) | Beryllium Copper | Beryllium Copper | ||||
VIEW |
1,176
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (1 x 20) | Beryllium Copper | Beryllium Copper | ||||
VIEW |
835
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 3 (Oval) | Beryllium Copper | Beryllium Copper | ||||
VIEW |
729
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TINLEAD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame, No Center Bar | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | 60.0µin (1.52µm) | Tin-Lead | 32 (2 x 16) | Phosphor Bronze | Brass, Copper | ||||
VIEW |
836
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 500 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | - | Tin-Lead | 20 (2 x 10) | Copper Alloy | Copper Alloy | ||||
VIEW |
2,717
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 500 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | Brass, Copper | ||||
VIEW |
1,927
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 500 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 18 (2 x 9) | Beryllium Copper | Beryllium Copper | ||||
VIEW |
3,297
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | 500 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Tin-Lead | 16 (2 x 8) | Beryllium Copper | Beryllium Copper | ||||
VIEW |
3,786
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 14POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 14 (1 x 14) | Beryllium Copper | Beryllium Copper | ||||
VIEW |
766
In-stock
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TE Connectivity AMP Connectors | CONN TRANSIST TO-3 3POS TIN-LEAD | 8080 | Active | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Fluoropolymer (FP) | - | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 3 (Oval) | Beryllium Copper | Beryllium Copper | ||||
VIEW |
3,036
In-stock
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TE Connectivity AMP Connectors | CONN TRANSIST TO-3 4POS GOLD | 8080 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Fluoropolymer (FP) | - | Gold | - | Tin-Lead | 4 (Round) | Beryllium Copper | Beryllium Copper | ||||
VIEW |
864
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 500 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | - | Tin-Lead | 8 (2 x 4) | Copper Alloy | Copper Alloy | ||||
VIEW |
1,623
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS GOLD | 500 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 22 (2 x 11) | Beryllium Copper | Brass, Copper |