Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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1,020
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Tin-Lead 200.0µin (5.08µm) Tin-Lead 3 (Oval) Beryllium Copper Beryllium Copper
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RFQ
3,037
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-3 Phenolic - Tin-Lead 200.0µin (5.08µm) Tin-Lead 3 (Oval) Beryllium Copper Beryllium Copper
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RFQ
2,750
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 10POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon - Gold - Tin-Lead 10 (Round) Beryllium Copper Brass
2-382468-4
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RFQ
2,801
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Tin-Lead 40 (2 x 20) Phosphor Bronze Phosphor Bronze
5-1437530-2
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RFQ
1,933
In-stock
TE Connectivity AMP Connectors CONN IC SIP SOCKET 8POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder - SIP Polyester 0.100" (2.54mm) Gold - Tin-Lead 8 (1 x 8) Beryllium Copper Brass
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RFQ
3,683
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-3 3POS TIN-LEAD 8060 Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Polytetrafluoroethylene (PTFE) - Tin-Lead - Tin-Lead 3 (Oval) Beryllium Copper Beryllium Copper
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RFQ
1,373
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Tin-Lead 32 (2 x 16) Phosphor Bronze Phosphor Bronze
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RFQ
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RFQ
3,779
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN-LEAD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - Tin-Lead 8 (2 x 4) Copper Alloy Copper Alloy
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RFQ
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RFQ
3,659
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Active Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Tin-Lead 20.0µin (0.51µm) Tin-Lead 3 (Round) Beryllium Copper Beryllium Copper
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RFQ
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RFQ
1,176
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (1 x 20) Beryllium Copper Beryllium Copper
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RFQ
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RFQ
835
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-3 Phenolic - Tin-Lead 200.0µin (5.08µm) Tin-Lead 3 (Oval) Beryllium Copper Beryllium Copper
1-2199300-2
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RFQ
729
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TINLEAD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, No Center Bar DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead 60.0µin (1.52µm) Tin-Lead 32 (2 x 16) Phosphor Bronze Brass, Copper
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RFQ
836
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Tin-Lead 20 (2 x 10) Copper Alloy Copper Alloy
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RFQ
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RFQ
2,717
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) Tin-Lead 28 (2 x 14) Beryllium Copper Brass, Copper
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RFQ
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RFQ
1,927
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 18 (2 x 9) Beryllium Copper Beryllium Copper
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RFQ
3,297
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) Tin-Lead 16 (2 x 8) Beryllium Copper Beryllium Copper
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RFQ
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RFQ
3,786
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 14POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 14 (1 x 14) Beryllium Copper Beryllium Copper
8080-1G15
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RFQ
766
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-3 3POS TIN-LEAD 8080 Active Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Fluoropolymer (FP) - Tin-Lead 200.0µin (5.08µm) Tin-Lead 3 (Oval) Beryllium Copper Beryllium Copper
8080-1G1
RFQ
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RFQ
3,036
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-3 4POS GOLD 8080 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-3 Fluoropolymer (FP) - Gold - Tin-Lead 4 (Round) Beryllium Copper Beryllium Copper
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RFQ
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RFQ
864
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Tin-Lead 8 (2 x 4) Copper Alloy Copper Alloy
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RFQ
1,623
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 22 (2 x 11) Beryllium Copper Brass, Copper