Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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3,271
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper Beryllium Copper
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1,793
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper Beryllium Copper
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2,378
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper Beryllium Copper
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3,527
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 40 (2 x 20) Phosphor Bronze Phosphor Bronze
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1,457
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper Nickel
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1,269
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper Copper
1-2199299-5
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3,663
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TE Connectivity AMP Connectors 40P,DIP SKT,600 CL,LDR,PB FREE Diplomate DL Active Bulk -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) 40 (2 x 20) Phosphor Bronze Nickel