Sockets for ICs, Transistors Products For Sale - PDF - Connectors, Interconnects -

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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
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	2-641264-1	RFQ VIEW	PDF RFQ	3,365 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 20POS TIN		Diplomate DL	Active	Tube	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Tin	-	20 (2 x 10)	Beryllium Copper
	2-641262-4	RFQ VIEW	PDF RFQ	3,214 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	16 (2 x 8)	Phosphor Bronze
	2-641264-4	RFQ VIEW	PDF RFQ	3,001 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 20POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	15.0µin (0.38µm)	20 (2 x 10)	Phosphor Bronze
	2-640358-2	RFQ VIEW	PDF RFQ	751 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	16 (2 x 8)	Beryllium Copper
	2-382462-1	RFQ VIEW	PDF RFQ	773 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 8POS TIN		Diplomate DL	Active	Tube	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Thermoplastic	0.100" (2.54mm)	Tin	-	8 (2 x 4)	Beryllium Copper

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