- Operating Temperature :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
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- 40 (2 x 20) (8)
- 42 (2 x 21) (1)
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55 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
1,588
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
3,551
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
2,339
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 22POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 22 (1 x 22) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
1,430
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
1,985
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 12POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 12 (1 x 12) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,005
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
3,700
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,370
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,196
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 18 (2 x 9) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
775
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 18 (2 x 9) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
3,365
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
1,733
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
1,710
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 18 (2 x 9) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
1,459
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 29POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 29 (1 x 29) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
729
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TINLEAD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame, No Center Bar | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | 60.0µin (1.52µm) | Tin-Lead | 32 (2 x 16) | Phosphor Bronze | 60.0µin (1.52µm) | Brass, Copper | |||
|
VIEW |
1,282
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
3,893
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 13POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 13 (1 x 13) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
2,554
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 17POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 17 (1 x 17) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
2,593
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 23POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 23 (1 x 23) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
3,243
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 14POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 14 (1 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,497
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
3,227
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,793
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 40 (2 x 20) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
2,378
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 40 (2 x 20) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
3,706
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 14 (2 x 7) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
3,214
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 16 (2 x 8) | Phosphor Bronze | 30.0µin (0.76µm) | Phosphor Bronze | |||
|
VIEW |
3,527
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 40 (2 x 20) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
3,089
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 21POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 21 (1 x 21) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,733
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 18 (2 x 9) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
3,125
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper |