Contact Finish - Mating :
Contact Finish Thickness - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
2,988
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
860
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
3,215
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
3,132
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
3,908
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
913
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
1,766
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
2,045
In-stock
Samtec Inc. CONN IC DIP SOCKET 24POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
1,847
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
2,438
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
606
In-stock
Samtec Inc. CONN IC DIP SOCKET 24POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
2,409
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS TIN ICA Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 32 (2 x 16) Beryllium Copper Brass