Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
1,703
In-stock
Samtec Inc. DIP SOCKETS ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
3,215
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
1,266
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS GOLD ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,927
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS GOLD ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,640
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS GOLD ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper