Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,243
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Samtec Inc. CONN IC DIP SOCKET 40POS TIN iCF Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin - Tin 40 (2 x 20) Beryllium Copper - Beryllium Copper
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1,703
In-stock
Samtec Inc. DIP SOCKETS ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper - Brass
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2,988
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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860
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper - Brass
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3,196
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS TIN iCF Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper - Beryllium Copper
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RFQ
3,215
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper - Brass
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RFQ
688
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS GOLD ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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3,132
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper - Brass
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3,908
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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RFQ
3,159
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS TIN iCF Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper - Beryllium Copper
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913
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper - Brass
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2,045
In-stock
Samtec Inc. CONN IC DIP SOCKET 24POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper - Brass
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RFQ
3,967
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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RFQ
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RFQ
1,266
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS GOLD ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
2,596
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS TIN iCF Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Beryllium Copper - Beryllium Copper
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RFQ
3,927
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS GOLD ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
ICA-628-SGT
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3,581
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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RFQ
3,146
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS TIN iCF Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Beryllium Copper - Beryllium Copper
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RFQ
1,640
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS GOLD ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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RFQ
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RFQ
2,438
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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606
In-stock
Samtec Inc. CONN IC DIP SOCKET 24POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper - Brass