- Termination :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (2 x 5) (102)
- 10 (2 x 5), 6 Loaded (2)
- 10 (2 x 5), 8 Loaded (2)
- 12 (2 x 6) (40)
- 12 (2 x 6), 6 Loaded (2)
- 14 (2 x 7) (51)
- 14 (2 x 7), 8 Loaded (2)
- 16 (2 x 8) (53)
- 16 (2 x 8), 4 Loaded (2)
- 16 (2 x 8), 8 Loaded (4)
- 18 (2 x 9) (47)
- 20 (2 x 10) (97)
- 22 (2 x 11) (88)
- 24 (2 x 12) (143)
- 28 (2 x 14) (143)
- 28 (2 x 14), 14 Loaded (2)
- 28 (2 x 14), 16 Loaded (2)
- 30 (2 x 15) (4)
- 32 (2 x 16) (91)
- 36 (2 x 18) (42)
- 4 (2 x 2) (40)
- 40 (2 x 20) (51)
- 42 (2 x 21) (44)
- 48 (2 x 24) (52)
- 50 (2 x 25) (48)
- 52 (2 x 26) (50)
- 56 (2 x 28) (4)
- 6 (2 x 3) (44)
- 64 (2 x 32) (16)
- 68 (2 x 34) (4)
- 8 (2 x 4) (44)
- Applied Filters :
1316 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
926
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,875
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 42POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 42 (2 x 21) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,227
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 48POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 48 (2 x 24) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,475
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 40POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 40 (2 x 20) | Beryllium Copper | - | Brass | |||
|
VIEW |
933
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 48POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 48 (2 x 24) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,790
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 36POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,057
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,490
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 50POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 50 (2 x 25) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,928
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 48POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 48 (2 x 24) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,344
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 56POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | 29.5µin (0.75µm) | Tin | 56 (2 x 28) | Beryllium Copper | - | Brass | |||
|
VIEW |
974
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,523
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 50POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 50 (2 x 25) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,946
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 28POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 28 (2 x 14) | Beryllium Copper | - | Brass | |||
|
VIEW |
649
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 28POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 28 (2 x 14) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,452
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 28POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 28 (2 x 14) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,807
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 42POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 42 (2 x 21) | Beryllium Copper | - | Brass | |||
|
VIEW |
877
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,517
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,114
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 42POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 42 (2 x 21) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,965
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 48POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 48 (2 x 24) | Beryllium Copper | - | Brass | |||
|
VIEW |
661
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
861
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,761
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 40POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 40 (2 x 20) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,558
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 36POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,532
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 48POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 48 (2 x 24) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,551
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 48POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 48 (2 x 24) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,654
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 48POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 48 (2 x 24) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,318
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 56POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | Flash | Tin | 56 (2 x 28) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,730
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 36POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,676
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 42POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 42 (2 x 21) | Beryllium Copper | - | Brass |