Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
BU200Z-178-HT
RFQ
VIEW
RFQ
3,457
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 20POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 20 (2 x 10) Beryllium Copper Flash Brass
SA203040
RFQ
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RFQ
2,644
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 20POS GOLD SA Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Gold 20 (2 x 10) Beryllium Copper 80.0µin (2.03µm) Brass
WMS-200Z
RFQ
VIEW
RFQ
3,660
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 20POS GOLD WMS Active Tube -40°C ~ 105°C Through Hole Solder Open Frame, Wash Away DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold Flash Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
SA203000
RFQ
VIEW
RFQ
1,710
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 20POS GOLD SA Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass