Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
299-43-640-10-002000
RFQ
VIEW
RFQ
1,165
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-43-620-10-002000
RFQ
VIEW
RFQ
3,295
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
614-43-640-31-012000
RFQ
VIEW
RFQ
723
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-43-640-41-005000
RFQ
VIEW
RFQ
1,519
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
111-43-640-41-001000
RFQ
VIEW
RFQ
2,031
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-43-628-41-005000
RFQ
VIEW
RFQ
3,015
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
214-44-624-01-670800
RFQ
VIEW
RFQ
2,352
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS TIN 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin 100.0µin (2.54µm) 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-43-622-10-002000
RFQ
VIEW
RFQ
2,714
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-43-642-41-005000
RFQ
VIEW
RFQ
792
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-43-628-41-801000
RFQ
VIEW
RFQ
2,107
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-43-608-10-002000
RFQ
VIEW
RFQ
3,935
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 8POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-640-41-003000
RFQ
VIEW
RFQ
2,308
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
111-43-632-41-001000
RFQ
VIEW
RFQ
2,746
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
111-43-624-41-001000
RFQ
VIEW
RFQ
3,549
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-43-648-41-001000
RFQ
VIEW
RFQ
1,330
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-43-640-41-001000
RFQ
VIEW
RFQ
1,685
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-632-41-001000
RFQ
VIEW
RFQ
2,999
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
214-44-632-01-670800
RFQ
VIEW
RFQ
2,665
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TIN 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin 100.0µin (2.54µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-41-640-41-001000
RFQ
VIEW
RFQ
2,913
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-43-624-41-001000
RFQ
VIEW
RFQ
686
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-43-656-41-005000
RFQ
VIEW
RFQ
2,949
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 56POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) 56 (2 x 28) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-43-624-41-801000
RFQ
VIEW
RFQ
1,663
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-43-620-41-005000
RFQ
VIEW
RFQ
3,810
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-43-632-10-002000
RFQ
VIEW
RFQ
2,046
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-43-668-41-005000
RFQ
VIEW
RFQ
3,176
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 68POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) 68 (2 x 34) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-43-614-10-002000
RFQ
VIEW
RFQ
3,773
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-43-664-41-005000
RFQ
VIEW
RFQ
3,524
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
614-43-632-31-012000
RFQ
VIEW
RFQ
1,087
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
614-43-628-31-012000
RFQ
VIEW
RFQ
3,576
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-43-648-41-005000
RFQ
VIEW
RFQ
1,997
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy