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- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
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13 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
1,897
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 28POS TIN | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,492
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,449
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 28POS TIN | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,242
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,069
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,382
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 32POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
915
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,500
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,070
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 32POS TINLEAD | DILB | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | 32 (2 x 16) | Copper Alloy | 100.0µin (2.54µm) | Copper Alloy | |||
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|
VIEW |
1,216
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 42POS TINLEAD | DILB | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | 42 (2 x 21) | Copper Alloy | 100.0µin (2.54µm) | Copper Alloy | |||
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|
VIEW |
3,083
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 24POS TINLEAD | DILB | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | 24 (2 x 12) | Copper Alloy | 100.0µin (2.54µm) | Copper Alloy | |||
|
VIEW |
2,345
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 40POS TIN | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 40 (2 x 20) | Copper Alloy | 100.0µin (2.54µm) | Copper Alloy | |||
|
VIEW |
3,490
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 28POS TIN | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 28 (2 x 14) | Copper Alloy | 100.0µin (2.54µm) | Copper Alloy | |||
