Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
DILB40P-223TLF
RFQ
VIEW
RFQ
2,345
In-stock
Amphenol FCI CONN IC DIP SOCKET 40POS TIN - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin 100.0µin (2.54µm) 40 (2 x 20) Copper Alloy
DILB28P-223TLF
RFQ
VIEW
RFQ
3,490
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin 100.0µin (2.54µm) 28 (2 x 14) Copper Alloy
DILB20P-223TLF
RFQ
VIEW
RFQ
2,062
In-stock
Amphenol FCI CONN IC DIP SOCKET 20POS TIN - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin 100.0µin (2.54µm) 20 (2 x 10) Copper Alloy
DILB16P-223TLF
RFQ
VIEW
RFQ
3,020
In-stock
Amphenol FCI CONN IC DIP SOCKET 16POS TIN - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin 100.0µin (2.54µm) 16 (2 x 8) Copper Alloy
DILB14P-223TLF
RFQ
VIEW
RFQ
3,259
In-stock
Amphenol FCI CONN IC DIP SOCKET 14POS TIN - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin 100.0µin (2.54µm) 14 (2 x 7) Copper Alloy
DILB8P-223TLF
RFQ
VIEW
RFQ
3,362
In-stock
Amphenol FCI CONN IC DIP SOCKET 8POS TIN - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin 100.0µin (2.54µm) 8 (2 x 4) Copper Alloy