Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,564
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Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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2,895
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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1,394
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Harwin Inc. CONN SOCKET SIP 16POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 16 (1 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
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3,254
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Harwin Inc. CONN SOCKET SIP 15POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 15 (1 x 15) Beryllium Copper 196.9µin (5.00µm) Brass
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2,473
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Harwin Inc. CONN SOCKET SIP 5POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 5 (1 x 5) Beryllium Copper 196.9µin (5.00µm) Brass
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2,435
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Harwin Inc. CONN SOCKET SIP 13POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 13 (1 x 13) Beryllium Copper 196.9µin (5.00µm) Brass
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2,297
In-stock
Harwin Inc. CONN SOCKET SIP 14POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 14 (1 x 14) Beryllium Copper 196.9µin (5.00µm) Brass
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1,741
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Harwin Inc. CONN SOCKET SIP 4POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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3,955
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Harwin Inc. CONN SOCKET SIP 9POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 9 (1 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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2,179
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Harwin Inc. CONN SOCKET SIP 11POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 11 (1 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
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1,981
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Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (1 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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3,859
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Harwin Inc. CONN SOCKET SIP 10POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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1,103
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Harwin Inc. CONN IC DIP SOCKET 48POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 48 (2 x 24) Beryllium Copper 196.9µin (5.00µm) Brass
D01-9953242
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1,101
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Harwin Inc. CONN SOCKET SIP 32POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 196.9µin (5.00µm) Brass
D01-9952042
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1,847
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Harwin Inc. CONN SOCKET SIP 20POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper 196.9µin (5.00µm) Brass
D01-9972042
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692
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Harwin Inc. CONN SOCKET SIP 20POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 20 (1 x 20) Beryllium Copper 196.9µin (5.00µm) Brass
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1,660
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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3,374
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Harwin Inc. CONN IC DIP SOCKET 36POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (2 x 18) Beryllium Copper 196.9µin (5.00µm) Brass
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1,909
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Harwin Inc. CONN IC DIP SOCKET 22POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
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959
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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3,875
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Harwin Inc. CONN IC DIP SOCKET 40POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 196.9µin (5.00µm) Brass
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779
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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3,637
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Harwin Inc. CONN SOCKET SIP 31POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 31 (1 x 31) Beryllium Copper 196.9µin (5.00µm) Brass
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3,524
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Harwin Inc. CONN IC DIP SOCKET 32POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
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2,031
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Harwin Inc. CONN SOCKET SIP 6POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 196.9µin (5.00µm) Brass
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2,995
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Harwin Inc. CONN SOCKET SIP 23POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 23 (1 x 23) Beryllium Copper 196.9µin (5.00µm) Brass
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762
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Harwin Inc. CONN SOCKET SIP 21POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 21 (1 x 21) Beryllium Copper 196.9µin (5.00µm) Brass
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2,081
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Harwin Inc. CONN SOCKET SIP 22POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 22 (1 x 22) Beryllium Copper 196.9µin (5.00µm) Brass
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1,791
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Harwin Inc. CONN SOCKET SIP 19POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 19 (1 x 19) Beryllium Copper 196.9µin (5.00µm) Brass
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1,659
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Harwin Inc. CONN SOCKET SIP 18POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (1 x 18) Beryllium Copper 196.9µin (5.00µm) Brass