- Part Status :
- Operating Temperature :
- Mounting Type :
- Termination :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Applied Filters :
16 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
1,888
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 400 | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | - | 8.00µin (0.203µm) | - | |||
|
|
VIEW |
2,183
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
3,440
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | Beryllium Copper | Flash | Brass | |||
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|
VIEW |
960
In-stock
|
3M | CONN IC DIP SOCKET 32POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
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|
VIEW |
2,809
In-stock
|
3M | CONN IC DIP SOCKET 32POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
|
|
VIEW |
2,422
In-stock
|
3M | CONN SOCKET PGA ZIF 32POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
|
VIEW |
1,947
In-stock
|
3M | CONN SOCKET PGA ZIF 32POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
|
VIEW |
2,466
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 400 | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | - | 8.00µin (0.203µm) | - | |||
|
|
VIEW |
1,777
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
2,087
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
994
In-stock
|
3M | CONN IC DIP SOCKET ZIF 32POS GLD | OEM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | 32 (2 x 16) | Beryllium Copper | 250.0µin (6.35µm) | Beryllium Copper | |||
|
VIEW |
1,728
In-stock
|
3M | CONN IC DIP SOCKET 32POS TIN | 4800 | Active | Tube | -25°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | 32 (2 x 16) | Phosphor Bronze | 35.0µin (0.90µm) | Phosphor Bronze | |||
|
VIEW |
2,294
In-stock
|
3M | CONN IC DIP SOCKET ZIF 32POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
2,043
In-stock
|
3M | CONN IC DIP SOCKET ZIF 32POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
2,038
In-stock
|
3M | CONN IC DIP SOCKET ZIF 32POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
3,954
In-stock
|
3M | CONN IC DIP SOCKET 32POS TIN | 4800 | Active | Tube | -25°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | 32 (2 x 16) | Phosphor Bronze | 35.0µin (0.90µm) | Phosphor Bronze | |||
