Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,512
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3M CONN IC DIP SOCKET 8POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 8 (2 x 4) Beryllium Copper Flash Brass
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1,154
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3M CONN IC DIP SOCKET 8POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 8 (2 x 4) Beryllium Copper Flash Brass
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3,255
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3M CONN IC DIP SOCKET 8POS TIN ICO Obsolete Tube -65°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 8 (2 x 4) Phosphor Bronze - Phosphor Bronze
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843
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3M CONN IC DIP SOCKET 8POS TIN ICO Obsolete Tube -65°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 8 (2 x 4) Phosphor Bronze - Phosphor Bronze
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1,956
In-stock
3M CONN IC DIP SOCKET 8POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 8 (2 x 4) Beryllium Copper Flash Brass
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2,323
In-stock
3M CONN IC DIP SOCKET 8POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 8 (2 x 4) Beryllium Copper Flash Brass
4808-3000-CP
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3,923
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3M CONN IC DIP SOCKET 8POS TIN 4800 Active Tube -25°C ~ 85°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 35.4µin (0.90µm) 8 (2 x 4) Phosphor Bronze 35.0µin (0.90µm) Phosphor Bronze
208-7391-55-1902
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3,864
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3M CONN SOCKET SOIC 8POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame SOIC Polyethersulfone (PES), Glass Filled - Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
4808-3004-CP
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2,351
In-stock
3M CONN IC DIP SOCKET 8POS TIN 4800 Active Tube -25°C ~ 85°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 35.4µin (0.90µm) 8 (2 x 4) Phosphor Bronze 35.0µin (0.90µm) Phosphor Bronze