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57 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | |
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GLOBAL STOCKS | |||||||||||||||||||||||
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VIEW |
3,406
In-stock
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3M | CONN SOCKET CLCC 68POS GOLD | OEM | Discontinued at Digi-Key | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | |||
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VIEW |
2,908
In-stock
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3M | CONN SOCKET CLCC 68POS GOLD | OEM | Discontinued at Digi-Key | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | |||
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VIEW |
1,245
In-stock
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3M | CONN SOCKET CLCC 68POS GOLD | OEM | Discontinued at Digi-Key | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | |||
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VIEW |
1,073
In-stock
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3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
2,180
In-stock
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3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
2,373
In-stock
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3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
1,639
In-stock
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3M | CONN IC DIP SOCKET 48POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
2,207
In-stock
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3M | CONN IC DIP SOCKET 42POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
2,933
In-stock
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3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
2,994
In-stock
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3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
2,183
In-stock
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3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
3,440
In-stock
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3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
1,585
In-stock
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3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
3,029
In-stock
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3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
2,054
In-stock
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3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
1,985
In-stock
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3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
3,431
In-stock
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3M | CONN IC DIP SOCKET 22POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 22 (2 x 11) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
3,019
In-stock
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3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
2,281
In-stock
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3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
2,853
In-stock
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3M | CONN IC DIP SOCKET 18POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
2,178
In-stock
|
3M | CONN IC DIP SOCKET 18POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
1,446
In-stock
|
3M | CONN IC DIP SOCKET 16POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
959
In-stock
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3M | CONN IC DIP SOCKET 16POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
2,387
In-stock
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3M | CONN IC DIP SOCKET 14POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
3,743
In-stock
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3M | CONN IC DIP SOCKET 14POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
3,976
In-stock
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3M | CONN IC DIP SOCKET 10POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 10 (2 x 5) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
1,512
In-stock
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3M | CONN IC DIP SOCKET 8POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
1,154
In-stock
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3M | CONN IC DIP SOCKET 8POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
3,608
In-stock
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3M | CONN IC DIP SOCKET 6POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 6 (2 x 3) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
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VIEW |
1,252
In-stock
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3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass |