Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post
GLOBAL STOCKS
240-3639-00-0602J
RFQ
VIEW
RFQ
815
In-stock
3M CONN IC DIP SOCKET ZIF 40POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm)
4840-6004-CP
RFQ
VIEW
RFQ
2,681
In-stock
3M CONN IC DIP SOCKET 40POS TIN 4800 Active Tube -25°C ~ 85°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 35.4µin (0.90µm) 40 (2 x 20) Phosphor Bronze 35.0µin (0.90µm)
4840-6000-CP
RFQ
VIEW
RFQ
2,957
In-stock
3M CONN IC DIP SOCKET 40POS TIN 4800 Active Tube -25°C ~ 85°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 35.4µin (0.90µm) 40 (2 x 20) Phosphor Bronze 35.0µin (0.90µm)
240-1288-00-0602J
RFQ
VIEW
RFQ
3,097
In-stock
3M CONN IC DIP SOCKET ZIF 40POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm)
240-1280-00-0602J
RFQ
VIEW
RFQ
783
In-stock
3M CONN IC DIP SOCKET ZIF 40POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm)