Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post
GLOBAL STOCKS
4824-3004-CP
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RFQ
2,717
In-stock
3M CONN IC DIP SOCKET 24POS TIN 4800 Active Tube -25°C ~ 85°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 35.4µin (0.90µm) 24 (2 x 12) Phosphor Bronze 35.0µin (0.90µm)
224-1286-00-0602J
RFQ
VIEW
RFQ
1,367
In-stock
3M CONN IC DIP SOCKET ZIF 24POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm)
224-5248-00-0602J
RFQ
VIEW
RFQ
776
In-stock
3M CONN IC DIP SOCKET ZIF 24POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm)
224-7397-55-1902
RFQ
VIEW
RFQ
1,305
In-stock
3M CONN SOCKET SOIC 24POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame SOIC Polyethersulfone (PES), Glass Filled - Gold - 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm)
4824-6000-CP
RFQ
VIEW
RFQ
2,721
In-stock
3M CONN IC DIP SOCKET 24POS TIN 4800 Active Tube -25°C ~ 85°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 35.4µin (0.90µm) 24 (2 x 12) Phosphor Bronze 35.0µin (0.90µm)
4824-6004-CP
RFQ
VIEW
RFQ
830
In-stock
3M CONN IC DIP SOCKET 24POS TIN 4800 Active Tube -25°C ~ 85°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 35.4µin (0.90µm) 24 (2 x 12) Phosphor Bronze 35.0µin (0.90µm)
4824-3000-CP
RFQ
VIEW
RFQ
2,455
In-stock
3M CONN IC DIP SOCKET 24POS TIN 4800 Active Tube -25°C ~ 85°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 35.4µin (0.90µm) 24 (2 x 12) Phosphor Bronze 35.0µin (0.90µm)
224-1275-00-0602J
RFQ
VIEW
RFQ
2,739
In-stock
3M CONN IC DIP SOCKET ZIF 24POS GLD Textool™ Active Tube -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm)