- Series :
- Operating Temperature :
- Mounting Type :
- Termination :
- Features :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
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9 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
|
VIEW |
1,572
In-stock
|
3M | CONN IC DIP SOCKET 28POS TIN | 4800 | Active | Tube | -25°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | 28 (2 x 14) | Phosphor Bronze | 35.0µin (0.90µm) | |||
|
VIEW |
1,410
In-stock
|
3M | CONN IC DIP SOCKET ZIF 28POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | |||
|
VIEW |
2,844
In-stock
|
3M | CONN IC DIP SOCKET ZIF 28POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | |||
|
VIEW |
1,560
In-stock
|
3M | CONN SOCKET SOIC 28POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | |||
|
VIEW |
3,100
In-stock
|
3M | CONN SOCKET SOIC 28POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | |||
|
VIEW |
1,543
In-stock
|
3M | CONN IC DIP SOCKET ZIF 28POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | |||
|
VIEW |
3,626
In-stock
|
3M | CONN IC DIP SOCKET 28POS TIN | 4800 | Active | Tube | -25°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | 28 (2 x 14) | Phosphor Bronze | 35.0µin (0.90µm) | |||
|
VIEW |
3,216
In-stock
|
3M | CONN IC DIP SOCKET ZIF 28POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | |||
|
VIEW |
3,346
In-stock
|
3M | CONN IC DIP SOCKET 28POS TIN | 4800 | Active | Tube | -25°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | 28 (2 x 14) | Phosphor Bronze | 35.0µin (0.90µm) | |||
