Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post
GLOBAL STOCKS
216-7383-55-1902
RFQ
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RFQ
1,809
In-stock
3M CONN SOCKET SOIC 16POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame SOIC Polyethersulfone (PES), Glass Filled - Gold 16 (2 x 8) Beryllium Copper 30.0µin (0.76µm)
216-7224-55-1902
RFQ
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RFQ
2,685
In-stock
3M CONN SOCKET SOIC 16POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame SOIC Polyethersulfone (PES), Glass Filled - Gold 16 (2 x 8) Beryllium Copper 30.0µin (0.76µm)