Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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3,079
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3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper
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RFQ
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RFQ
1,594
In-stock
3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper
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RFQ
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RFQ
1,340
In-stock
3M CONN ZIG-ZAG ZIF 35POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 35 (1 x 17, 1 x 18) Beryllium Copper
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RFQ
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RFQ
1,425
In-stock
3M CONN ZIG-ZAG ZIF 35POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 35 (1 x 17, 1 x 18) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,872
In-stock
3M CONN ZIG-ZAG ZIF 35POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 35 (1 x 17, 1 x 18) Beryllium Copper
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RFQ
VIEW
RFQ
1,541
In-stock
3M CONN ZIG-ZAG ZIF 35POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 35 (1 x 17, 1 x 18) Beryllium Copper
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RFQ
VIEW
RFQ
2,113
In-stock
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 34 (2 x 17) Beryllium Copper
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RFQ
VIEW
RFQ
2,128
In-stock
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 34 (1 x 34) Beryllium Copper
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RFQ
VIEW
RFQ
3,597
In-stock
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 34 (2 x 17) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
941
In-stock
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 34 (2 x 17) Beryllium Copper
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RFQ
VIEW
RFQ
2,422
In-stock
3M CONN SOCKET PGA ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper
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RFQ
VIEW
RFQ
1,947
In-stock
3M CONN SOCKET PGA ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper
224-5809-00-0602
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VIEW
RFQ
1,283
In-stock
3M CONN SOCKET SIP ZIF 24POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 24 (1 x 24) Beryllium Copper
232-2601-00-0602
RFQ
VIEW
RFQ
792
In-stock
3M CONN SOCKET SIP ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 32 (1 x 32) Beryllium Copper
251-5949-01-0602
RFQ
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RFQ
2,126
In-stock
3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper
251-5949-02-0602
RFQ
VIEW
RFQ
3,265
In-stock
3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper
236-6225-00-0602
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RFQ
3,826
In-stock
3M CONN SOCKET SIP ZIF 36POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 36 (1 x 36) Beryllium Copper
290-1294-00-3302J
RFQ
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RFQ
2,597
In-stock
3M CONN IC DIP SOCKET ZIF 90POS GLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.070" (1.78mm) Gold 30.0µin (0.76µm) 90 (2 x 45) Beryllium Copper
220-2600-00-0602
RFQ
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RFQ
3,468
In-stock
3M CONN SOCKET SIP ZIF 20POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 20 (1 x 20) Beryllium Copper
210-2599-00-0602
RFQ
VIEW
RFQ
3,164
In-stock
3M CONN SOCKET SIP ZIF 10POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 10 (1 x 10) Beryllium Copper