- Number of Positions or Pins (Grid) :
- Applied Filters :
15 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||
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VIEW |
3,287
In-stock
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3M | CONN SOCKET SOIC 18POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 18 (2 x 9) | Beryllium Copper | - | |||
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VIEW |
977
In-stock
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3M | STAGGERED ZIP STRIP POCKETS 32 C | Textool™ | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
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VIEW |
3,194
In-stock
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3M | STAGGERED ZIP STRIP POCKETS 32 C | Textool™ | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
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VIEW |
1,809
In-stock
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3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 16 (2 x 8) | Beryllium Copper | - | |||
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VIEW |
1,037
In-stock
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3M | CONN SOCKET QFN 32POS GOLD | Textool™ | Active | Bulk | - | Through Hole | Solder | Closed Frame | QFN | Polyethersulfone (PES) | - | Gold | - | 32 (4 x 8) | Beryllium Copper | - | |||
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VIEW |
1,560
In-stock
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3M | CONN SOCKET SOIC 28POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 28 (2 x 14) | Beryllium Copper | - | |||
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VIEW |
2,685
In-stock
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3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 16 (2 x 8) | Beryllium Copper | - | |||
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VIEW |
783
In-stock
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3M | CONN SOCKET SOIC 14POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 14 (2 x 7) | Beryllium Copper | - | |||
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VIEW |
2,214
In-stock
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3M | CONN SOCKET QFN 40POS GOLD | Textool™ | Active | Bulk | - | Through Hole | Solder | Closed Frame | QFN | Polyethersulfone (PES) | - | Gold | - | 40 (4 x 10) | Beryllium Copper | - | |||
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VIEW |
1,901
In-stock
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3M | CONN SOCKET QFN 40POS GOLD | Textool™ | Active | Bulk | - | Through Hole | Solder | Closed Frame | QFN | Polyethersulfone (PES) | - | Gold | - | 40 (4 x 10) | Beryllium Copper | - | |||
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VIEW |
1,305
In-stock
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3M | CONN SOCKET SOIC 24POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 24 (2 x 12) | Beryllium Copper | - | |||
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VIEW |
2,716
In-stock
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3M | CONN SOCKET SOIC 20POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 20 (2 x 10) | Beryllium Copper | - | |||
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VIEW |
3,100
In-stock
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3M | CONN SOCKET SOIC 28POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 28 (2 x 14) | Beryllium Copper | - | |||
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VIEW |
1,992
In-stock
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3M | CONN TRANSIST TO-3/TO-66 3POS | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 and TO-66 | Polyphenylene Sulfide (PPS), Glass Filled | - | Gold | 30.0µin (0.76µm) | 3 (Rectangular) | Beryllium Copper | 0.234" (5.94mm) | |||
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VIEW |
3,864
In-stock
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3M | CONN SOCKET SOIC 8POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | - |