Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Termination Features Style Material Flammability Rating Connector Type Number of Positions Number of Rows Number of Positions Loaded Fastening Type Contact Material Insulation Color Contact Type Pitch - Mating Shrouding Contact Length - Mating Contact Length - Post Overall Contact Length Insulation Height Contact Shape Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Insulation Material
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0015913327
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VIEW
RFQ
899
In-stock
Molex, LLC CGRID SMT BKWY HDR TIN 32CKT C-Grid® 71308 Active Tube Surface Mount Solder Pick and Place Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) - - 0.050" (1.27mm) Square Tin 150.0µin (3.81µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0010897320
RFQ
VIEW
RFQ
3,901
In-stock
Molex, LLC BKWY HEADER 30 SAU 32POS C-Grid® 70280 Active Bulk Through Hole Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) 0.107" (2.71mm) 0.437" (11.10mm) 0.090" (2.29mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0702871210
RFQ
VIEW
RFQ
1,855
In-stock
Molex, LLC CONN HEADER BKWY DL GOLD 32POS C-Grid® 70287 Active Bulk Through Hole Kinked Pin, Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) 0.125" (3.18mm) 0.455" (11.56mm) 0.090" (2.29mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0015911320
RFQ
VIEW
RFQ
2,123
In-stock
Molex, LLC CONN HEADER 32POS GOLD SMD C-Grid® 71308 Active Tube Surface Mount Solder Board Guide Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.320" (8.13mm) - - 0.050" (1.27mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0015911323
RFQ
VIEW
RFQ
2,558
In-stock
Molex, LLC CONN HEADER 32POS GOLD SMD C-Grid® 71308 Active Tube Surface Mount Solder Board Guide Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) - - 0.050" (1.27mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0702800804
RFQ
VIEW
RFQ
3,660
In-stock
Molex, LLC CONN HDR BKWY VERT GOLD 32POS C-Grid® 70280 Active Bulk Through Hole Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.320" (8.13mm) 0.185" (4.70mm) 0.595" (15.11mm) 0.090" (2.29mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0015910327
RFQ
VIEW
RFQ
3,874
In-stock
Molex, LLC CONN HEADER 32POS GOLD SMD C-Grid® 71308 Active Tube Surface Mount Solder Board Guide Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.320" (8.13mm) - - 0.050" (1.27mm) Square Gold 15.0µin (0.38µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0702800684
RFQ
VIEW
RFQ
3,182
In-stock
Molex, LLC CONN HDR BKWY VERT GOLD 32POS C-Grid® 70280 Active Bulk Through Hole Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) 0.175" (4.45mm) 0.505" (12.83mm) 0.090" (2.29mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0702871259
RFQ
VIEW
RFQ
2,922
In-stock
Molex, LLC CONN HEADER BKWY DL GOLD 32POS C-Grid® 70287 Active Bulk Through Hole Kinked Pin, Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.320" (8.13mm) 0.125" (3.18mm) 0.535" (13.59mm) 0.090" (2.29mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0015911324
RFQ
VIEW
RFQ
2,635
In-stock
Molex, LLC CONN HEADER 32POS TIN SMD C-Grid® 71308 Active Tube Surface Mount Solder Board Guide Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.320" (8.13mm) - - 0.050" (1.27mm) Square Tin 150.0µin (3.81µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0015911322
RFQ
VIEW
RFQ
1,463
In-stock
Molex, LLC CONN HEADER 32POS GOLD SMD C-Grid® 71308 Active Tube Surface Mount Solder Board Guide Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) - - 0.050" (1.27mm) Square Gold 15.0µin (0.38µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0015915329
RFQ
VIEW
RFQ
1,950
In-stock
Molex, LLC CGRID SMT BKWY HDR 30 SAU 32CKT C-Grid® 71308 Active Tube Surface Mount Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.320" (8.13mm) - - 0.090" (2.29mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0015913320
RFQ
VIEW
RFQ
1,656
In-stock
Molex, LLC CONN BKWY HEADER 32POS GOLD SMD C-Grid® 71308 Active Tube Surface Mount Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) - - 0.090" (2.29mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0702800764
RFQ
VIEW
RFQ
3,666
In-stock
Molex, LLC CONN HDR BKWY VERT GOLD 32POS C-Grid® 70280 Active Bulk Through Hole Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.320" (8.13mm) 0.185" (4.70mm) 0.595" (15.11mm) 0.090" (2.29mm) Square Gold 15.0µin (0.38µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0702800644
RFQ
VIEW
RFQ
1,414
In-stock
Molex, LLC CONN HDR BKWY VERT GOLD 32POS C-Grid® 70280 Active Bulk Through Hole Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) 0.175" (4.45mm) 0.505" (12.83mm) 0.090" (2.29mm) Square Gold 15.0µin (0.38µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0015910328
RFQ
VIEW
RFQ
1,371
In-stock
Molex, LLC CONN HEADER 32POS GOLD SMD C-Grid® 71308 Active Tube Surface Mount Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.320" (8.13mm) - - 0.090" (2.29mm) Square Gold 15.0µin (0.38µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0702871161
RFQ
VIEW
RFQ
925
In-stock
Molex, LLC CONN HEADER BKWY DL GOLD 32POS C-Grid® 70287 Active Bulk Through Hole Kinked Pin, Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.320" (8.13mm) 0.125" (3.18mm) 0.535" (13.59mm) 0.090" (2.29mm) Square Gold 15.0µin (0.38µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0015912320
RFQ
VIEW
RFQ
2,370
In-stock
Molex, LLC CONN BKWY HEADER 32POS TIN SMD C-Grid® 71308 Active Tube Surface Mount Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) - - 0.090" (2.29mm) Square Tin 150.0µin (3.81µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0015910320
RFQ
VIEW
RFQ
2,283
In-stock
Molex, LLC CONN HEADER 32POS GOLD SMD C-Grid® 71308 Active Tube Surface Mount Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) - - 0.090" (2.29mm) Square Gold 15.0µin (0.38µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0010977326
RFQ
VIEW
RFQ
3,550
In-stock
Molex, LLC CGRID VT BKWY HDR 15 SAU 32CKT ( C-Grid® 70280 Active Bulk Through Hole Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.320" (8.13mm) 0.110" (2.79mm) 0.520" (13.21mm) 0.090" (2.29mm) Square Gold 15.0µin (0.38µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0702871112
RFQ
VIEW
RFQ
2,501
In-stock
Molex, LLC CONN HEADER BKWY DL GOLD 32POS C-Grid® 70287 Active Bulk Through Hole Kinked Pin, Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) 0.125" (3.18mm) 0.455" (11.56mm) 0.090" (2.29mm) Square Gold 15.0µin (0.38µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
Default Photo
RFQ
VIEW
RFQ
2,386
In-stock
Molex, LLC CONN HDR BKWY VERT TIN 32POS C-Grid® 70280 Active Bulk Through Hole Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.320" (8.13mm) 0.185" (4.70mm) 0.595" (15.11mm) 0.090" (2.29mm) Square Tin 150.0µin (3.81µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
Default Photo
RFQ
VIEW
RFQ
3,212
In-stock
Molex, LLC CONN HDR BKWY VERT TIN 32POS C-Grid® 70280 Active Bulk Through Hole Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) 0.175" (4.45mm) 0.505" (12.83mm) 0.090" (2.29mm) Square Tin 150.0µin (3.81µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0713085432
RFQ
VIEW
RFQ
2,275
In-stock
Molex, LLC CONN HEADER BKWY SMD TIN 32POS C-Grid® 71308 Active Tube Surface Mount Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) - - 0.090" (2.29mm) Square Tin 59.0µin (1.50µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0702871063
RFQ
VIEW
RFQ
816
In-stock
Molex, LLC CONN HEADER BKWY DL TIN 32POS C-Grid® 70287 Active Bulk Through Hole Kinked Pin, Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.320" (8.13mm) 0.125" (3.18mm) 0.535" (13.59mm) 0.090" (2.29mm) Square Tin 150.0µin (3.81µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0702871014
RFQ
VIEW
RFQ
1,561
In-stock
Molex, LLC CONN HEADER BKWY DL TIN 32POS C-Grid® 70287 Active Bulk Through Hole Kinked Pin, Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) 0.125" (3.18mm) 0.455" (11.56mm) 0.090" (2.29mm) Square Tin 150.0µin (3.81µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0010897322
RFQ
VIEW
RFQ
768
In-stock
Molex, LLC CONN HDR DUAL 32POS .100 SRT AU C-Grid® 70280 Active Bulk Through Hole Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) 0.107" (2.71mm) 0.437" (11.10mm) 0.090" (2.29mm) Square Gold 15.0µin (0.38µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
0010897321
RFQ
VIEW
RFQ
3,245
In-stock
Molex, LLC CONN HDR DUAL 32POS .100 SRT TIN C-Grid® 70280 Active Bulk Through Hole Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) 0.107" (2.71mm) 0.437" (11.10mm) 0.090" (2.29mm) Square Tin 150.0µin (3.81µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
Default Photo
RFQ
VIEW
RFQ
1,326
In-stock
Molex, LLC 2.54MM DRSW HDR TH 32CKT C-Grid® 87914 Active Tray Through Hole Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.240" (6.10mm) 0.107" (2.71mm) 0.437" (11.10mm) 0.090" (2.29mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP), Glass Filled
Default Photo
RFQ
VIEW
RFQ
3,321
In-stock
Molex, LLC 2.54MM DRSW HDR TH 32CKT C-Grid® 87914 Active Tray Through Hole Solder - Board to Board or Cable UL94 V-0 Header, Breakaway 32 2 All Push-Pull Copper Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.320" (8.13mm) 0.110" (2.79mm) 0.520" (13.21mm) 0.090" (2.29mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP), Glass Filled