- Manufacture :
- Contact Material :
- Pitch - Mating :
- Contact Length - Mating :
- Insulation Height :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Insulation Material :
- Applied Filters :
12 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Mounting Type | Termination | Features | Style | Material Flammability Rating | Connector Type | Number of Positions | Number of Rows | Number of Positions Loaded | Fastening Type | Contact Material | Insulation Color | Contact Type | Pitch - Mating | Shrouding | Contact Length - Mating | Contact Length - Post | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Insulation Material | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||||||||||||||
|
VIEW |
2,123
In-stock
|
Molex, LLC | CONN HEADER 32POS GOLD SMD | C-Grid® 71308 | Active | Tube | Surface Mount | Solder | Board Guide | Board to Board or Cable | UL94 V-0 | Header, Breakaway | 32 | 2 | All | Push-Pull | Copper Alloy | Black | Male Pin | 0.100" (2.54mm) | Unshrouded | 0.320" (8.13mm) | - | 0.050" (1.27mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Liquid Crystal Polymer (LCP), Glass Filled | |||
|
VIEW |
2,558
In-stock
|
Molex, LLC | CONN HEADER 32POS GOLD SMD | C-Grid® 71308 | Active | Tube | Surface Mount | Solder | Board Guide | Board to Board or Cable | UL94 V-0 | Header, Breakaway | 32 | 2 | All | Push-Pull | Copper Alloy | Black | Male Pin | 0.100" (2.54mm) | Unshrouded | 0.240" (6.10mm) | - | 0.050" (1.27mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Liquid Crystal Polymer (LCP), Glass Filled | |||
|
VIEW |
3,272
In-stock
|
Amphenol FCI | BERGSTIK | BERGSTIK® | Active | Bulk | Surface Mount | Solder | Board Guide | Board to Board | UL94 V-0 | Header, Breakaway | 32 | 2 | All | Push-Pull | Phosphor Bronze | Black | Male Pin | 0.100" (2.54mm) | Unshrouded | 0.230" (5.84mm) | - | 0.084" (2.14mm) | Square | Gold, GXT™ | 30.0µin (0.76µm) | Tin | Thermoplastic | |||
|
VIEW |
3,874
In-stock
|
Molex, LLC | CONN HEADER 32POS GOLD SMD | C-Grid® 71308 | Active | Tube | Surface Mount | Solder | Board Guide | Board to Board or Cable | UL94 V-0 | Header, Breakaway | 32 | 2 | All | Push-Pull | Copper Alloy | Black | Male Pin | 0.100" (2.54mm) | Unshrouded | 0.320" (8.13mm) | - | 0.050" (1.27mm) | Square | Gold | 15.0µin (0.38µm) | Tin | Liquid Crystal Polymer (LCP), Glass Filled | |||
|
VIEW |
2,635
In-stock
|
Molex, LLC | CONN HEADER 32POS TIN SMD | C-Grid® 71308 | Active | Tube | Surface Mount | Solder | Board Guide | Board to Board or Cable | UL94 V-0 | Header, Breakaway | 32 | 2 | All | Push-Pull | Copper Alloy | Black | Male Pin | 0.100" (2.54mm) | Unshrouded | 0.320" (8.13mm) | - | 0.050" (1.27mm) | Square | Tin | 150.0µin (3.81µm) | Tin | Liquid Crystal Polymer (LCP), Glass Filled | |||
|
VIEW |
1,463
In-stock
|
Molex, LLC | CONN HEADER 32POS GOLD SMD | C-Grid® 71308 | Active | Tube | Surface Mount | Solder | Board Guide | Board to Board or Cable | UL94 V-0 | Header, Breakaway | 32 | 2 | All | Push-Pull | Copper Alloy | Black | Male Pin | 0.100" (2.54mm) | Unshrouded | 0.240" (6.10mm) | - | 0.050" (1.27mm) | Square | Gold | 15.0µin (0.38µm) | Tin | Liquid Crystal Polymer (LCP), Glass Filled | |||
|
VIEW |
1,255
In-stock
|
Molex, LLC | CONN HEADER 32POS 2MM VERT SMD | Milli-Grid™ 87759 | Active | Tube | Surface Mount | Solder | Board Guide | Board to Board or Cable | UL94 V-0 | Header, Breakaway | 32 | 2 | All | Push-Pull | Phosphor Bronze | Black | Male Pin | 0.079" (2.00mm) | Unshrouded | 0.150" (3.81mm) | - | 0.059" (1.50mm) | Square | Gold | 15.0µin (0.38µm) | Tin | Thermoplastic | |||
|
VIEW |
2,152
In-stock
|
Amphenol FCI | BERGSTIK | BERGSTIK® | Active | Bulk | Surface Mount | Solder | Board Guide | Board to Board | UL94 V-0 | Header, Breakaway | 32 | 2 | All | Push-Pull | Phosphor Bronze | Black | Male Pin | 0.100" (2.54mm) | Unshrouded | 0.318" (8.08mm) | - | 0.084" (2.14mm) | Square | Gold, GXT™ | 15.0µin (0.38µm) | Tin-Lead | Thermoplastic | |||
|
VIEW |
2,116
In-stock
|
Amphenol FCI | BERGSTIK | BERGSTIK® | Active | Bulk | Surface Mount | Solder | Board Guide | Board to Board | UL94 V-0 | Header, Breakaway | 32 | 2 | All | Push-Pull | Phosphor Bronze | Black | Male Pin | 0.100" (2.54mm) | Unshrouded | 0.230" (5.84mm) | - | 0.084" (2.14mm) | Square | Gold, GXT™ | 15.0µin (0.38µm) | Tin-Lead | Thermoplastic | |||
|
VIEW |
763
In-stock
|
Amphenol FCI | BERGSTIK | BERGSTIK® | Active | Bulk | Surface Mount | Solder | Board Guide | Board to Board | UL94 V-0 | Header, Breakaway | 32 | 2 | All | Push-Pull | Phosphor Bronze | Black | Male Pin | 0.100" (2.54mm) | Unshrouded | 0.318" (8.08mm) | - | 0.084" (2.14mm) | Square | Gold, GXT™ | 30.0µin (0.76µm) | Tin | Thermoplastic | |||
|
VIEW |
3,835
In-stock
|
Molex, LLC | CONN HEADER 32POS GOLD SMD | C-Grid® 71308 | Active | Tube | Surface Mount | Solder | Board Guide | Board to Board or Cable | UL94 V-0 | Header, Breakaway | 32 | 2 | All | Push-Pull | Copper Alloy | Black | Male Pin | 0.100" (2.54mm) | Unshrouded | 0.240" (6.10mm) | - | 0.050" (1.27mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Liquid Crystal Polymer (LCP), Glass Filled | |||
|
VIEW |
796
In-stock
|
Molex, LLC | CONN HEADER 32POS TIN SMD | C-Grid® 71308 | Active | Tube | Surface Mount | Solder | Board Guide | Board to Board or Cable | UL94 V-0 | Header, Breakaway | 32 | 2 | All | Push-Pull | Copper Alloy | Black | Male Pin | 0.100" (2.54mm) | Unshrouded | 0.240" (6.10mm) | - | 0.050" (1.27mm) | Square | Tin | 150.0µin (3.81µm) | Tin | Liquid Crystal Polymer (LCP), Glass Filled |