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82 results
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Style Current Rating Material Flammability Rating Connector Type Number of Positions Number of Rows Number of Positions Loaded Fastening Type Voltage Rating Contact Material Insulation Color Contact Type Pitch - Mating Row Spacing - Mating Shrouding Contact Length - Mating Contact Length - Post Overall Contact Length Insulation Height Contact Shape Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Insulation Material
GLOBAL STOCKS
77311-424-32LF
77311-424-32LF
RFQ
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RFQ
800
In-stock
 Amphenol FCI BERGSTIK BERGSTIK® Active Bulk - Through Hole Solder - Board to Board - UL94 V-0 Header 32 1 All Push-Pull - Phosphor Bronze Black Male Pin 0.100" (2.54mm) - Unshrouded 0.266" (6.75mm) 0.114" (2.90mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Tin 78.7µin (2.00µm) Tin Thermoplastic
Default Photo
TSS-116-01-G-D
RFQ
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RFQ
2,925
In-stock
 Samtec Inc. LOW PROFILE .025 SQ STRIPS Flex Stack, TSS Active Tube -55°C ~ 125°C Through Hole Solder Keying Slot Board to Board or Cable - UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Black Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Shrouded - 4 Wall 0.250" (6.35mm) 0.115" (2.92mm) 0.480" (12.19mm) 0.350" (8.89mm) Square Gold 10.0µin (0.25µm) Gold Polybutylene Terephthalate (PBT)
Default Photo
HMTSW-116-24-G-D-290
RFQ
VIEW
RFQ
3,886
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.290" (7.37mm) 0.090" (2.29mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP)
Default Photo
HMTSW-116-24-G-D-225
RFQ
VIEW
RFQ
3,571
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.225" (5.72mm) 0.155" (3.94mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP)
Default Photo
HMTSW-116-24-G-D-200
RFQ
VIEW
RFQ
2,859
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.200" (5.08mm) 0.180" (4.57mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP)
Default Photo
HMTSW-116-24-G-D-100
RFQ
VIEW
RFQ
3,575
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.100" (2.54mm) 0.280" (7.11mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP)
Default Photo
TSS-132-01-F-S
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VIEW
RFQ
1,176
In-stock
 Samtec Inc. LOW PROFILE .025 SQ STRIPS Flex Stack, TSS Active Tube -55°C ~ 125°C Through Hole Solder Keying Slot Board to Board or Cable - UL94 V-0 Header 32 1 All Push-Pull - Phosphor Bronze Black Male Pin 0.100" (2.54mm) - Shrouded - 4 Wall 0.250" (6.35mm) 0.115" (2.92mm) 0.480" (12.19mm) 0.350" (8.89mm) Square Gold 3.00µin (0.076µm) Tin Polybutylene Terephthalate (PBT)
350-10-132-00-018101
350-10-132-00-018101
RFQ
VIEW
RFQ
2,120
In-stock
 Preci-Dip CONN HDR 32POS T/H 0.100 GOLD 350 Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board 3A UL94 V-0 Header 32 1 All Push-Pull 150VDC Brass Black Male Pin 0.100" (2.54mm) - Unshrouded 0.169" (4.30mm) 0.124" (3.15mm) 0.480" (12.19mm) 0.110" (2.79mm) Circular Gold 10.0µin (0.25µm) Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Default Photo
HMTSW-116-24-L-Q-225
RFQ
VIEW
RFQ
2,048
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.200" (5.08mm) Unshrouded 0.225" (5.72mm) 0.155" (3.94mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
HMTSW-116-24-L-Q-200
RFQ
VIEW
RFQ
2,906
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.200" (5.08mm) Unshrouded 0.200" (5.08mm) 0.180" (4.57mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
HMTSW-116-24-L-Q-100
RFQ
VIEW
RFQ
1,622
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.200" (5.08mm) Unshrouded 0.100" (2.54mm) 0.280" (7.11mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
HTSW-116-24-G-D
RFQ
VIEW
RFQ
2,311
In-stock
 Samtec Inc. .025'' SQ. TERMINAL STRIPS HTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable Varies by Wire Gauge UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.265" (6.73mm) 0.115" (2.92mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP)
Default Photo
HMTSW-116-24-L-D-290
RFQ
VIEW
RFQ
3,132
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.290" (7.37mm) 0.090" (2.29mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
HMTSW-116-24-L-D-225
RFQ
VIEW
RFQ
1,845
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.225" (5.72mm) 0.155" (3.94mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
HMTSW-116-24-L-D-200
RFQ
VIEW
RFQ
1,437
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.200" (5.08mm) 0.180" (4.57mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
HMTSW-116-24-L-D-100
RFQ
VIEW
RFQ
3,741
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.100" (2.54mm) 0.280" (7.11mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
TSS-116-01-L-D
RFQ
VIEW
RFQ
1,755
In-stock
 Samtec Inc. LOW PROFILE .025 SQ STRIPS Flex Stack, TSS Active Tube -55°C ~ 125°C Through Hole Solder Keying Slot Board to Board or Cable - UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Black Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Shrouded - 4 Wall 0.250" (6.35mm) 0.115" (2.92mm) 0.480" (12.19mm) 0.350" (8.89mm) Square Gold 10.0µin (0.25µm) Tin Polybutylene Terephthalate (PBT)
929647-09-32-EU
929647-09-32-EU
RFQ
VIEW
RFQ
3,443
In-stock
 3M CONN HEADER .100" SNGL STR 32POS 929 Active Bulk -40°C ~ 105°C Through Hole Solder - Board to Board 2.5A UL94 V-0 Header, Breakaway 32 1 All Push-Pull - Copper Alloy Black Male Pin 0.100" (2.54mm) - Unshrouded 0.235" (5.97mm) 0.145" (3.68mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Polycyclohexylenedimethylene Terephthalate (PCT)
450-10-232-00-018101
450-10-232-00-018101
RFQ
VIEW
RFQ
1,647
In-stock
 Preci-Dip CONN HDR 32POS 2.54MM T/H 450 Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board 3A UL94 V-0 Header 32 2 All Push-Pull 150VDC Brass Black Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.169" (4.30mm) 0.124" (3.15mm) 0.480" (12.19mm) 0.110" (2.79mm) Circular Gold 10.0µin (0.25µm) Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Default Photo
HTSW-116-24-L-D
RFQ
VIEW
RFQ
3,908
In-stock
 Samtec Inc. .025'' SQ. TERMINAL STRIPS HTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable Varies by Wire Gauge UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.265" (6.73mm) 0.115" (2.92mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
TSS-132-01-T-S
RFQ
VIEW
RFQ
1,989
In-stock
 Samtec Inc. LOW PROFILE .025 SQ STRIPS Flex Stack, TSS Active Tube -55°C ~ 105°C Through Hole Solder Keying Slot Board to Board or Cable - UL94 V-0 Header 32 1 All Push-Pull - Phosphor Bronze Black Male Pin 0.100" (2.54mm) - Shrouded - 4 Wall 0.250" (6.35mm) 0.115" (2.92mm) 0.480" (12.19mm) 0.350" (8.89mm) Square Tin - Tin Polybutylene Terephthalate (PBT)
Default Photo
HMTSW-116-24-T-Q-225
RFQ
VIEW
RFQ
3,797
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 105°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.200" (5.08mm) Unshrouded 0.225" (5.72mm) 0.155" (3.94mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP)
Default Photo
HMTSW-116-24-T-Q-200
RFQ
VIEW
RFQ
1,675
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 105°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.200" (5.08mm) Unshrouded 0.200" (5.08mm) 0.180" (4.57mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP)
Default Photo
HMTSW-116-24-T-Q-100
RFQ
VIEW
RFQ
2,376
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 105°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.200" (5.08mm) Unshrouded 0.100" (2.54mm) 0.280" (7.11mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP)
Default Photo
HTSW-116-24-F-D
RFQ
VIEW
RFQ
1,360
In-stock
 Samtec Inc. .025'' SQ. TERMINAL STRIPS HTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable Varies by Wire Gauge UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.265" (6.73mm) 0.115" (2.92mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP)
929836-09-16
929836-09-16
RFQ
VIEW
RFQ
3,753
In-stock
 3M CONN HEADER .100 DUAL STR 32POS 929 Active Bulk -40°C ~ 105°C Through Hole Solder - Board to Board 2.5A UL94 V-0 Header 32 2 All Push-Pull - Copper Alloy Black Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.235" (5.97mm) 0.145" (3.68mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Tin-Lead 100.0µin (2.54µm) - Polybutylene Terephthalate (PBT), Polyester, Glass Filled
Default Photo
TSS-116-01-F-D
RFQ
VIEW
RFQ
697
In-stock
 Samtec Inc. LOW PROFILE .025 SQ STRIPS Flex Stack, TSS Active Tube -55°C ~ 125°C Through Hole Solder Keying Slot Board to Board or Cable - UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Black Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Shrouded - 4 Wall 0.250" (6.35mm) 0.115" (2.92mm) 0.480" (12.19mm) 0.350" (8.89mm) Square Gold 3.00µin (0.076µm) Tin Polybutylene Terephthalate (PBT)
Default Photo
HMTSW-132-24-T-S-175
RFQ
VIEW
RFQ
1,402
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 105°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 1 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) - Unshrouded 0.175" (4.45mm) 0.205" (5.21mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP)
Default Photo
HMTSW-116-24-T-D-290
RFQ
VIEW
RFQ
1,722
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 105°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.290" (7.37mm) 0.090" (2.29mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP)
Default Photo
HMTSW-116-24-T-D-225
RFQ
VIEW
RFQ
3,130
In-stock
 Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 105°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 32 2 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) 0.100" (2.54mm) Unshrouded 0.225" (5.72mm) 0.155" (3.94mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP)
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