Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Style Current Rating Connector Type Number of Positions Number of Rows Number of Positions Loaded Fastening Type Contact Material Contact Type Pitch - Mating Row Spacing - Mating Shrouding Insulation Height Contact Shape Contact Finish - Mating Contact Finish Thickness - Mating Insulation Material
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3,040
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ITT Cannon, LLC MICRO MTB Active Bulk -55°C ~ 150°C Through Hole, Right Angle Solder - Board to Cable/Wire 3A Header 7 1 All Push-Pull Copper Alloy Male Pin 0.050" (1.27mm) - Unshrouded 0.100" (2.54mm) Circular Gold 50.0µin (1.27µm) Diallyl Phthalate (DAP)
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611
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ITT Cannon, LLC MICRO MTB Active Bulk -55°C ~ 150°C Through Hole Solder - Board to Cable/Wire 3A Header 7 1 All Push-Pull Copper Alloy Male Pin 0.050" (1.27mm) - Unshrouded 0.100" (2.54mm) Circular Gold 50.0µin (1.27µm) Diallyl Phthalate (DAP)
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1,810
In-stock
ITT Cannon, LLC MICRO MTB Active Bulk -55°C ~ 150°C Through Hole, Right Angle Solder - Board to Cable/Wire 3A Header 7 1 All Push-Pull Copper Alloy Male Pin 0.050" (1.27mm) - Unshrouded 0.100" (2.54mm) Circular Gold 50.0µin (1.27µm) Diallyl Phthalate (DAP)
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1,085
In-stock
ITT Cannon, LLC MICRO MTB Active Bulk -55°C ~ 150°C Through Hole, Right Angle Solder - Board to Cable/Wire 3A Header 7 1 All Push-Pull Copper Alloy Male Pin 0.050" (1.27mm) - Unshrouded 0.100" (2.54mm) Circular Gold 50.0µin (1.27µm) Diallyl Phthalate (DAP)
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RFQ
3,037
In-stock
ITT Cannon, LLC MICRO MTB Active Bulk -55°C ~ 150°C Through Hole Solder Guide Pin Board to Cable/Wire 3A Header 7 1 All Push-Pull Copper Alloy Male Pin 0.050" (1.27mm) - Unshrouded 0.100" (2.54mm) Circular Gold 50.0µin (1.27µm) Diallyl Phthalate (DAP)
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RFQ
1,078
In-stock
ITT Cannon, LLC MICRO MTB Active Bulk -55°C ~ 150°C - Solder - Board to Cable/Wire 3A Header 7 1 All Push-Pull Copper Alloy Male Pin 0.050" (1.27mm) - Unshrouded 0.100" (2.54mm) Circular Gold 50.0µin (1.27µm) Diallyl Phthalate (DAP)