Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Style Current Rating Material Flammability Rating Connector Type Number of Positions Number of Rows Number of Positions Loaded Fastening Type Contact Material Insulation Color Contact Type Pitch - Mating Shrouding Contact Length - Mating Contact Length - Post Overall Contact Length Insulation Height Contact Shape Contact Finish - Mating Contact Finish Thickness - Mating Insulation Material
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TLW-132-05-T-S
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RFQ
2,503
In-stock
Samtec Inc. CONN HEADER .100" 32POS SNGL TIN Flex Stack, TLW Active Bulk -55°C ~ 105°C Through Hole Solder - Board to Board or Cable 5.2A per Contact - Header 32 1 All Push-Pull Phosphor Bronze Black Male Pin 0.100" (2.54mm) Unshrouded 0.105" (2.67mm) 0.170" (4.32mm) 0.335" (8.51mm) 0.060" (1.52mm) Square Tin - Liquid Crystal Polymer (LCP)
TLW-116-05-T-D
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RFQ
755
In-stock
Samtec Inc. CONN HEADER .100" 32POS DUAL TIN Flex Stack, TLW Active Bulk -55°C ~ 105°C Through Hole Solder - Board to Board or Cable 5.2A per Contact - Header 32 2 All Push-Pull Phosphor Bronze Black Male Pin 0.100" (2.54mm) Unshrouded 0.105" (2.67mm) 0.170" (4.32mm) 0.335" (8.51mm) 0.060" (1.52mm) Square Tin - Liquid Crystal Polymer (LCP)
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RFQ
3,125
In-stock
Amphenol FCI HEADER BERGSTIK BERGSTIK® II Obsolete Bulk - Through Hole Solder - Board to Board - UL94 V-0 Header 32 1 All Push-Pull Phosphor Bronze Black Male Pin 0.100" (2.54mm) Unshrouded 0.170" (4.32mm) 0.170" (4.32mm) 0.440" (11.18mm) 0.100" (2.54mm) Square Gold or Gold, GXT™ 30.0µin (0.76µm) -
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RFQ
1,299
In-stock
Amphenol FCI HEADER BERGSTIK BERGSTIK® II Obsolete Bulk - Through Hole Solder - Board to Board - UL94 V-0 Header 32 2 All Push-Pull - Black Male Pin 0.100" (2.54mm) Unshrouded 0.318" (8.08mm) 0.170" (4.32mm) 0.588" (14.94mm) 0.100" (2.54mm) Square Tin 100.0µin (2.54µm) -
87894-132HLF
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RFQ
1,961
In-stock
Amphenol FCI HEADER BERGSTIK BERGSTIK® II Obsolete Bulk - Through Hole Solder - Board to Board - UL94 V-0 Header 32 2 All Push-Pull - Black Male Pin 0.100" (2.54mm) Unshrouded 0.318" (8.08mm) 0.170" (4.32mm) 0.588" (14.94mm) 0.100" (2.54mm) Square Gold or Gold, GXT™ 30.0µin (0.76µm) -
TLW-132-05-G-S
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RFQ
1,772
In-stock
Samtec Inc. CONN HEADER .100" 32POS SGL GOLD Flex Stack, TLW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 5.2A per Contact - Header 32 1 All Push-Pull Phosphor Bronze Black Male Pin 0.100" (2.54mm) Unshrouded 0.105" (2.67mm) 0.170" (4.32mm) 0.335" (8.51mm) 0.060" (1.52mm) Square Gold 10.0µin (0.25µm) Liquid Crystal Polymer (LCP)
TLW-116-05-G-D
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RFQ
1,789
In-stock
Samtec Inc. CONN HEADER .100" 32POS DL GOLD Flex Stack, TLW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 5.2A per Contact - Header 32 2 All Push-Pull Phosphor Bronze Black Male Pin 0.100" (2.54mm) Unshrouded 0.105" (2.67mm) 0.170" (4.32mm) 0.335" (8.51mm) 0.060" (1.52mm) Square Gold 10.0µin (0.25µm) Liquid Crystal Polymer (LCP)